Electronics Forum | Wed Apr 30 12:26:10 EDT 2008 | dphilbrick
There must be discussions about this on SMTnet but I have yet to find them. I would like to hear from all you smart people about running LF and PB BGA�s on the same board using 63/37 solder. If you run your profile up to peak at around 225C +/- (nitr
Electronics Forum | Tue Sep 16 09:35:12 EDT 2008 | babe7362000
Can anyone tell me if there is a procedure for storing raw PCB's? We currently are seeing an issue with lead free boards with dewetting. We tracked it down to one or two datecodes, but not all of the boards have dewetting. Is there a expiration da
Electronics Forum | Tue Dec 30 11:29:13 EST 2008 | davef
People use green soldermask because people use green soldermask. In the 1950s, the US military selected green, because they liked green better than other colors. So, here we are. We believe the performance of red and blue is comparable with green. T
Electronics Forum | Thu Jan 22 11:07:14 EST 2009 | boardhouse
Hi Jeff, Unfortunately there is just as many bad shops in the US. Communication & doing your Due diligence is the best solution. I sell for Taiwan now but sold for a US shop for 10 years. Taiwan Quality is as good or better than most US Shops and
Electronics Forum | Tue Feb 10 02:14:39 EST 2009 | emmanueldavid
Smartasp, Seems this issue is certainly making a long thread ! As far as our Experience is concerned on Reflow Soldering, particular parts must have failed in LSLs [Lower Specification Limit] and have not withstand well under USLs [Upper Specificat
Electronics Forum | Thu Apr 30 02:39:48 EDT 2009 | michafogel
Thanks for the info so far, but still need a number or a formula to calculate. The site you have point me to can support in a way, but if I want to release a design procedure to our editors, a number will be very helpful. One more issue is what can b
Electronics Forum | Tue Jun 02 21:27:22 EDT 2009 | davef
We've never heard of a situtation where oversized pads caused voiding. Your supplier is correct that the pads on the board should be the same size as the pads on the interposer, but this is to improve reliability issues. Search the fine SMTnet Archi
Electronics Forum | Thu Oct 08 11:33:16 EDT 2009 | cab
We are currently wirebonding MCMs with surface components located in very close proximity to wirebond pads, which are gold plated. We are ball bonding with 99.99% Au wire. Normally we do not have problems, however if product has been reflowed seve
Electronics Forum | Thu Nov 05 03:40:34 EST 2009 | valeo
Hi Rajeshmara, Mail sent with the datasheet of the glue we use in production. Thanks for first information you provide me for the shear specifications on 1206. But can you be more precise on this point ? How did you define it ? Is anyone have more
Electronics Forum | Thu Nov 05 16:56:38 EST 2009 | lynn_norman
In a previous job, we had torque off requirements for different sized components for our screen print adhesive (non-conductive in our case). We used a torque watch that would measure max torque, so we could test production boards, shear testing was