Electronics Forum | Mon Oct 19 14:24:06 EDT 1998 | Justin Medernach
| | | | | | | | It seems like most people want to X-Ray their BGAs. We're going to start doing a lot more of them and need to consider X-ray, too. | | | | | | | | Q: Do most people/companies X-ray everyBGA or do they just do SPC? | | | | | | | | Q:
Electronics Forum | Mon Mar 08 05:11:36 EST 1999 | Earl Moon
| | | And on it goes. Again, I can't thank you enough for your time. I will call you soon as others probably find this rhetoric a bit much. | | | | Earl Moon | | | Earl and Dean, | | No,no,no...please continue here. I've been gratefully rea
Electronics Forum | Mon Nov 06 21:06:13 EST 2000 | Dave F
Thomas: Wheeee, a 40% failure rate. Now, that make your boss chase you around the room won�t it? As you indicated, x-ray won�t do dip about helping to identifying problems [or ball cracks either]. Consider using an ERSA scope [er whatever they ca
Electronics Forum | Mon Dec 06 05:18:53 EST 1999 | Wolfgang Busko
Hi Russ, assuming that only your flux changed and the PCB-finish stayed the same it seems to me that the solderability of that finish is somehow poor. About Ni/Au it can be said that the solderconnection is made between Ni and Sn. The Au-finish is ju
Electronics Forum | Thu Oct 08 03:27:00 EDT 1998 | Thomas Blesinger
| | | I am trying to find out, what possibilities I have, to print solder paste on a board, when the task is to have 120 Microns thickness for the biggest part of the board (85% of the real estate), and then have 250 Microns of thickness on the rema
Electronics Forum | Thu Oct 08 22:32:58 EDT 1998 | Dave F
| | | | I am trying to find out, what possibilities I have, to print solder paste on a board, when the task is to have 120 Microns thickness for the biggest part of the board (85% of the real estate), and then have 250 Microns of thickness on the re
Electronics Forum | Thu Jul 30 14:16:32 EDT 1998 | Phil Crane
| WHAT SHOULD THE RATIO BE OF STENCIL APERATURE TO PAD TO GET GOOD QUALITY RESULTS. BY THAT I MEAN, A MINIMM OF SOLDER BALLS, AND LITTLE TO NO BRIDGING, SHORTS, ETC.. | RIGHT NOW WE ARE USING A 1:1 RATIO, BUT ARE INVESTIGATING REDUCING THE APERATU
Electronics Forum | Sun Aug 02 06:54:26 EDT 1998 | Bob Willis
You may liketo contact Chemtech in the UK. http://chemteck.co.uk as they have a new hand book on stencils and a design guide due for release shortly there is also some stencil information as a survey on types and price on my web sites under surveys h
Electronics Forum | Mon May 18 20:57:06 EDT 1998 | Earl Moon
.025" pitch so the only problem we run into is too much HASL on the adhesive side causing improper glue dispense. | As Earl keeps saying HASL thickness is hard to impossible to control. I think we need to look hard at OSP's again but then you get in
Electronics Forum | Tue Sep 25 12:50:13 EDT 2001 | mparker
Since you are mostly concerned about the flux and suspect an application issue, you need to do a few things to validate whats going on. 1. Forget about speed of processing, length of time to do the job. Focus on accuracy first, then speed. with that
