Electronics Forum | Wed Mar 01 03:39:10 EST 2006 | dave
Hi Davef, Basically there is very poor signs of wetting ,the hole fill from the top of the board is non-existant and we are using 63/37 solder bars (wave solder machine).
Electronics Forum | Tue May 29 09:58:32 EDT 2007 | davef
Is the component solderable per ANSI/J-STD-002, Solderability Tests for Component Leads, Terminations, Lugs, Terminals, and Wires?
Electronics Forum | Tue Jul 24 07:57:55 EDT 2007 | davef
It sounds like the QFN component is not solderable. * Use ANSI/J-STD-002, Solderability Tests for Component Leads, Terminations, Lugs, Terminals, and Wires * Contact your QFN component supplier for help * Consider a more active flux, since you might
Electronics Forum | Mon Aug 09 12:36:19 EDT 2010 | cobar
IPC TM 650- Solderability of Metallic Surfaces http://www.shanelo.co.za/List%20of%20articles/IPC%202.4.14%20Solderability%20of%20Metalic%20Surfaces.pdf
Electronics Forum | Thu Mar 24 18:16:24 EDT 2011 | bandjwet
Dear SMTNetters: Does anyone have a good method for determining the solderability of leaded high power resistors? We currently are using Dip and Look and they always pass yet solderability issues remain... Thanks! BWET
Electronics Forum | Wed Aug 09 09:29:09 EDT 2017 | edhare
I recommend examining the problem pads and a representative bare board using SEM/EDS to determine if the problem is related to a board solderability issue. I can support this type of analysis (www.semlab.com).
Electronics Forum | Fri Dec 27 14:27:40 EST 2019 | slthomas
We switched to a REL0 T3 paste, Amtech LF-4300. It wets the castellations more consistently. I believe that in our case it was more of a plating wetting issue with the parts, but yours sounds more like a pcb finish or thermal issue. That larger pad
Electronics Forum | Fri Dec 02 08:52:05 EST 2005 | pavel_murtishev
Good evening, I�ve just solved very similar soldering issue. In my case the problem was with 0603 chips. Solder joint had same appearance. I suspected that solder do not melted and increased TAL and peak temperature. No result. Next thing I tried to
Electronics Forum | Fri Dec 27 12:47:21 EST 2019 | ameenullakhan
Dear Team, We are facing open solder issue in a sensor component. Rejection rate is 2 out of 50 components placed. The issue is very random. We have tried increasing the solder paste height from 5 mil to 7 mil. The issue persist still. Differen
Electronics Forum | Fri Jun 22 20:20:24 EDT 2012 | hegemon
Is this a new process or are you experiencing a change in results from an already established process? We have KISS Slective Soldering (2 machines)and we do not have these issues, but we are not doing NC either, we are fully aqueous, using Nitrogen
