Electronics Forum | Wed Aug 09 08:06:07 EDT 2006 | davef
See "IPC-4554 Specification for Immersion Tin Plating for Printed Circuit Boards" 3.2.1 Immersion Tin Thickness. The most common reason for solderability issues with the white tin surface coating during multiple thermal excursions is a thin white ti
Electronics Forum | Tue Jul 24 07:15:16 EDT 2007 | james
We are currently have failures on one of our QFN components. We are running this product with lead free paste, lead free boards and lead free parts. They have done a pull test on this component and it showed that the solder joint mainly dissconnect
Electronics Forum | Thu Sep 30 16:28:51 EDT 2010 | 18424
Hello All, looking for some help from you guru's. I have several Enig boards with solderability problems. Components ranging from 0402's to ssop's. Using AIM W/S leaded solder paste, profile is beautiful and has been for years running the same produc
Electronics Forum | Wed Jul 14 13:41:40 EDT 2010 | rway
We are running SMT products and have been for some time now. First, I wanted to check with you folks to see what an acceptable FPY rate, or what you would consider and acceptable rate, is. Secondly, we are having issues primarily with product that
Electronics Forum | Tue Dec 10 05:03:58 EST 2002 | praveen
We are having solder fillet finish issue. The solder looks like rough solder on the connector leads .The plating of the leads is Nickel (99.9% purity) and the PCB plating is imersion gold. I have tried fine tuning my reflow profiles an have used N2 i
Electronics Forum | Fri Nov 07 08:12:24 EST 2003 | caldon
From my understanding (and I am not a metalurgist)Most Lead free solders can be intercahngeable.The alloy created should be stable. The issue is if you add Leaded solder to the joint. Obviously, research and testing is still pending. cal
Electronics Forum | Mon Mar 19 11:26:21 EST 2001 | Steve
Another issue is that once solder paste has been reflowed, the majority of the flux is gone. If it is reflowed again without solder flux, the risk of introducing oxidation to the component leads is increased, thus creating a weak solder joint.
Electronics Forum | Fri Jul 08 10:13:15 EDT 2005 | fctassembly
Hi Jason, Did the SAC paste wet other board finishes adequately? I have seen no issues to date with solderability of SN100CL HASL boards with our No Clean pastes. Regards, Bob
Electronics Forum | Fri Oct 31 09:26:08 EDT 2014 | rgduval
I do not recommend ever leaving the top of a via-in-pad open. Cap the via in the pad. Leaving it open for "solder to stuff the hole" causes issues in assembly, notably insufficient solder due to vampirism (the solder wicks into the via, rather than
Electronics Forum | Mon Jan 09 23:24:47 EST 2017 | saju86ece
Hi, We are doing pin in paste reflow process in one our product ( but paste printed on bottom side of the board and top side will be assembled through hole component)in which faced cold solder issue in THT capacitor location after reflow. The solder
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