Electronics Forum | Tue Mar 12 22:27:50 EST 2002 | davef
I'd speculate that the properties of a well formed solder connection processed in air and N2 are indistinguishable. Then again, the pitch is that N2 gives a wider process window, especially for NC flux-types. In the SMTnet Library look for: �Opti
Electronics Forum | Mon Sep 24 18:00:58 EDT 2001 | jagman
Does anyone know the cause(s) of solder flowing through a via to the other side of board during reflow causing solder bumps on opposite side? Is this mainly a design issue or could it be process related? Any help is appreciated.
Electronics Forum | Fri Nov 24 06:59:54 EST 2006 | LM
I remember many moons ago seeing a refridgerator for storing solder paste which issued them out in a FIFO manner and had the option of a PC and bar code scanner for logging them in and out to the lines. I can't seem to find any trace of it on the net
Electronics Forum | Mon Apr 23 11:05:36 EDT 2018 | proceng1
Does anyone have an ESE LX3 printer installed and running at their facility? I'm curious if you've had any problems, or major break-downs. I'm wondering in your experience how it handles different color solder mask. Any issues you found with the squ
Electronics Forum | Fri Jul 18 10:46:43 EDT 2003 | davef
If you are saying that you have discolored white tin at in-bound inspection, you have bad boards. The boards are fabricated incorrectly. Your fabricator is deficient. That is the GREAT thing about imm coatings. You can look at them and determine
Electronics Forum | Mon Apr 23 09:18:15 EDT 2001 | Brandon
We are currently investigating getting a small SMT line in-house...very low quantities. I have been looking at Screen Printers and have also stumbled across Solid Solder Deposit Technology at 2 companies. I'm not sure whether we want to have the So
Electronics Forum | Tue Feb 24 09:52:14 EST 2004 | davef
First, two points about hole / barrel fill are: * A filled hole is an excellent indicator of the optimum process and optimum quality PCB. * The study that showed that holes need not be filled was paid for by the US Army and performed by Lockheed in
Electronics Forum | Mon Dec 27 13:28:11 EST 1999 | Brian W.
Depending on the components you are seeing this on, one thing to check would be the solderability of the parts. Sometimes you will find the plating leeches away, and this is a component plating issue. When you solder, the plating actually leeches a
Electronics Forum | Tue Jul 31 10:41:49 EDT 2001 | ronho
I'm interested in process information from someone who has experience with this package, such as pad design, stencil aperture dimensions, stencil thickness, unique issues, profiling, solder paste. Design is considering this package for future produc
Electronics Forum | Fri Aug 06 07:16:36 EDT 2004 | davef
When moisture outgasses through plating, it continues through the molten solder, causing a meak solder connection. There's another issue with thin plating that we haven't focused on in this thread. If plating is thin, the stress on the barrel of a
