Electronics Forum | Thu Sep 03 02:38:00 EDT 2009 | sachu_70
Does the established joint still exist if once again re-touched by a soldering iron, or does it return to the original problem? Wetting issues on pad could be for many reasons and you could analyze with a cause effect diagram.
Electronics Forum | Tue Oct 28 17:40:58 EST 2003 | davef
We theorize a secondary [bottom] side BGA can be wave soldered with planning. Issues are: * Keepout between the BGA and one side of the board that is clear of PTH parts requiring wave soldering, so to support the fixture. * Keepout around the BGA. *
Electronics Forum | Fri Feb 15 08:44:42 EST 2008 | mmjm_1099
FYI, Here are the steps in which we take to get approval. The stencil gerber layer needs final approval through our Engineering dept. What they do is send in a gerber layer from the stencil house and lays it over the current solder paste layer and ve
Electronics Forum | Fri May 27 10:34:05 EDT 2005 | Rob
Hi Joris, I've used 10's of Millions of these (and the AVX version - PBRC****) and never found this problem (I also worked for Murata back in the mists of time & never encountered it). Internally the part is thermally symmetrical, so the only thing
Electronics Forum | Tue Nov 20 12:31:12 EST 2007 | kelz
In my past experience, having via's under or attached to SMD lands produces risk. Solder will not consistently wick the same if it is being drawn into a via. This has also caused issues from solder wetting through the via to the other side causing a
Electronics Forum | Fri Dec 07 10:29:17 EST 2007 | dyoungquist
Even if it is 300 hours, using a conservative estimate of that time being worth $20/hr the machine saved $6,000 in one month. At $6,000/month the ROI is probably no more than 1 year which is good. From what I have seen in this forum over the last c
Electronics Forum | Wed Oct 28 06:43:13 EDT 2015 | derrikf
That's my main concern, the patchy/splotchy appearance doesn't look as pretty, especially under a microscope. When it was mentioned that my oven may be too hot in the ramp-to-faux-soak it was the first thing I tried adjusting. As far as our blade pre
Electronics Forum | Wed Dec 23 09:11:56 EST 2009 | lynn_norman
In a former life, we used hi temp solder. I've heard of adhesive and taping methods, we just never used them. We too had a "golden" assembly that we would use for routine profiling. Our requirement was to attach a TC to the lowest thermal mass, hi
Electronics Forum | Wed Mar 30 15:16:35 EST 2005 | Rashid
Hi, I've measured a rework profile on a summit 750. my nearby parts are heating up as high as 178 to 182 degrees C. I'm concerned that this fine pitch parts that are nearby are affected specially their solder joints going to close to melting point.
Electronics Forum | Thu Oct 05 16:03:31 EDT 2006 | C.K. the Flip
I had horrible experiences with a certain brand on multiple types of BGA's (I choose not to mention the brand). The paste was nice and active, but almost to a fault when it came to BGA's. Finally, I arrived at a profile with a more agressive ramp u
