Electronics Forum | Wed Apr 10 13:20:36 EDT 2002 | barryg
I am curious how you measure your printed paste thickness. We are considering doing the same. As it is now we assure we have squeegee pressure and speed controlled, have not actually measure the printed paste thickness.
Electronics Forum | Wed Apr 10 22:35:59 EDT 2002 | davef
How do you assure you "have squeegee pressure and speed controlled"? Search the fine SMTnet Archives for background on measuring paste thickness.
Electronics Forum | Thu Apr 11 12:10:14 EDT 2002 | jax
Different Solder types are not needed. Surface tension will hold most. Plenty of info in the archives about reflow profiles, weight limitations, etc...
Electronics Forum | Sat May 04 21:08:11 EDT 2002 | saiwong
Special solder paste means you can't use the cheap one in low end procusts. You have to such as Multicore on the CP7. Sai
Electronics Forum | Mon Apr 15 18:42:23 EDT 2002 | paulausten
Do the in/out board sensors on reflow solder machine work well? Can they be relied on or do they cause needless alarms? What has been your experience?
Electronics Forum | Mon Apr 22 18:45:07 EDT 2002 | Steve Townsend
Chances are your profile is fine. There is probably too much paste on the descrete pads. Consider reducing the aperture size of the stencil. Good luck.
Electronics Forum | Mon Apr 29 03:01:53 EDT 2002 | Bob Willis
Had a similar problem recently where there were scatered balls and voids in joints and on the surface of the joints. The paste was dispenced from a cartridge with no kneeding or mixing before printing. The result was spitting and voids. Mixed the pa
Electronics Forum | Thu Apr 25 15:00:51 EDT 2002 | russ
Great info Dave!! Do you know what is meant by "foil"? I am really curious? Russ
Electronics Forum | Mon Apr 29 10:07:00 EDT 2002 | geoff_goring
I need to find out about tin/lead diffusion and how this causes solderability problems in device lead-outs. This is not to be confused with an earlier thread of Zn/Pb diffusion - unfortunately this is was a typo.
Electronics Forum | Thu May 02 07:11:10 EDT 2002 | davef
They probably the same. Most likely someone is saying immersion gold [immersion Au] as a short hand for ENIG [ Electroless Nickel - Immersion Gold]. It is very uncommon to plate gold directly on copper, because gold and copper form a brittle interm
