Electronics Forum | Sun Oct 20 19:42:29 EDT 2002 | sjpence
Like Russ, I am also curious about the 100% fill requirement. On any thick, high mass board the key is getting as much heat as possible into the board. If you get the board to the proper temperature, solder will flow just about anywhere. As an alte
Electronics Forum | Wed Oct 23 08:40:20 EDT 2002 | davef
Yer not making this easy. What kind of flux? If no-clean flux, what controls are you using to assure you are: * Applying the correct amount of flux? * Properly activating the flux? If water washable flux, talk to us about your cleaning methods and
Electronics Forum | Thu Oct 24 15:02:16 EDT 2002 | seand
Hello Yannick, Have you brought this concern up with your supplier? I would recommend speaking with your flux and paste provider to gain additional insight and recommendations for resolving the concern. Good luck, Sean D.
Electronics Forum | Thu Oct 24 03:03:13 EDT 2002 | harriss
Hi: The component height will increase on the PCB after reflow soldering. But i don't know the accurate data of the increased height. Who can help me to get it? The stencil thickness is 5 mil we used. Thanks Harriss
Electronics Forum | Thu Oct 24 13:32:03 EDT 2002 | russ
There are many factors that will affect post soldering height. Lead shape/type, pad geometry, fillet formation, etc... You will need to measure each type of component before and after reflow. Russ
Electronics Forum | Fri Oct 25 04:06:56 EDT 2002 | kcngoi
Hi Adam, Excessive heat from soldering iron will left the burn mark of RMA flux. The residue is hard to remove. Suggest to use the Flux pen for better control.
Electronics Forum | Thu Oct 31 09:28:15 EST 2002 | russ
Toe fillets are not required per IPC, you can actually have toe overhang. Russ
Electronics Forum | Thu Oct 31 01:52:17 EST 2002 | jason
Anybody with experience on such a rework ?? The QFP has thermal pads underneath the body and needs to be re-connected when subjected for rework... Any ideas ???
Electronics Forum | Tue Nov 05 00:51:39 EST 2002 | yngwie
How to measure the max allowable force when we press the heatsink at the attachment process. I was posted with question by my customer, " how to I ensure that the force I use to attach the heatsink does not causing any damage to the solder joint on t
Electronics Forum | Wed Nov 06 09:01:59 EST 2002 | russ
Syringes seem to keep the paste fresher longer since there is less exposure to air than a jar. It is also nice to be able to just squeeze the trigger on a gun instead of using a spatula in my opinion. Russ
