Electronics Forum | Wed Jan 21 17:43:04 EST 2004 | Kris
Hi, I had the same question. In our case we are contacting the copper with the osp coating (not soldered). any published reports that we can reference Thanks
Electronics Forum | Thu Jan 22 09:21:45 EST 2004 | davef
Oh, another thing, we do not like to probe copper. It's hard, compared to solder, and beats-up the probes too much. [As Patrick Bruneel states in this thread.] Consider reflowing paste on your test pads.
Electronics Forum | Sat Jan 24 08:18:41 EST 2004 | davef
This is the book that Kevin wants to sell: http://www.elchempub.com/epfiles/ep29.htm It is a very good book and covers topics, like pad design for wave soldering SMT devices, that no other authors touch upon.
Electronics Forum | Mon Jan 26 04:13:48 EST 2004 | patthemack
First of all, did you profile this board with a mole, such as a KIC? Is the solder flowing, or just not wetting to the part or pad? I work with RF boards as well, but the main problem is tombstoning due to the ground plane side being larger because o
Electronics Forum | Tue Jan 27 10:57:23 EST 2004 | samaniegocesar
Hello Dave The information you sent me will be the base to start some samples, I'm doing some test with Heraeus and Indium solder paste.. I apreciate your support.. Best regards...
Electronics Forum | Mon Feb 02 22:01:24 EST 2004 | Dean
I find this disturbing when customers dictate your process and equipment? Your responsibility is to deliver a quality product on time. Why would your customer care HOW you achieve this? Hence the success of Chinese manufacturing. I have one custo
Electronics Forum | Tue Feb 03 12:24:56 EST 2004 | swagner
Paul, do you have any kind of false failure data for the application you struggled with? Also what amount of manpower did you use to operate the system(s).
Electronics Forum | Thu Feb 05 08:39:16 EST 2004 | davef
IPC-2222 - Sectional Design Standard For Printed Board For Organic Printed Boards, Table 9-3 � Plated Through Hole Diameter To Lead Diameter Relationships will give you the standard information you require.
Electronics Forum | Sat Feb 14 20:30:55 EST 2004 | Dean
What are your preheat rates? Try a slower ramp. A typical insurance policy is to kapton tape the gold card edge. If your problem persists, try baking the boards to drive the moisture out.
Electronics Forum | Mon Feb 16 06:26:14 EST 2004 | Chris Lampron
Jun, What is your RH in the SMT area? Is a different paste used on this product than on the other lines. Could your paste be absorbing humidity from the air and discharging the moisture at reflow? This will cuase what you are describing. Good Luck
.gif)
