Electronics Forum | Thu Apr 15 08:23:47 EDT 2004 | prod
hi, Having put a copper socket trough a wave soldering machine, and then through a DI wash, the boards have been dried and after a few days a green residue has been noticed on the copper. any suggestions? not drying properly maybe? or could it be th
Electronics Forum | Thu Apr 15 17:48:15 EDT 2004 | davef
When we see dewetted solder on pads, we sprint to get sections done, in order to determine if over-exuberant pumice scrubbing by the fabricator has buried material in the copper.
Electronics Forum | Fri Apr 23 12:47:29 EDT 2004 | barry
I have increased my peak to 220, and Flow is better, but it still not quite a good fillet all around. The solder tends to kinda "bunchup" at the toe of the lead. If part is Pb free, would this affect adhesion and or flow?
Electronics Forum | Mon May 24 16:34:03 EDT 2004 | Mark
I just got a report from MacDermid on Solder Mask Interface Attack Issue (SMIA) with Sterling Silver Process. Corrosive chemicals in the ImAg process get trapped under the soldermask edge and eat at the copper trace. They are experimenting with diffe
Electronics Forum | Wed Apr 21 18:24:13 EDT 2004 | pjohnson@volterra.com
Simple process - we use similar Kester solder brands of "no clean" low residue solder wick to clean our pads, then brush with isopropyl, and apply Kesters brand of tacky flux under a Leica 6x microscope. We do this on 7x7mm and 9x9mm packages. This w
Electronics Forum | Thu Apr 22 18:02:04 EDT 2004 | davef
Could you be looking for this: http://www.assemblymag.com/CDA/ArticleInformation/features/BNP__Features__Item/0,6493,108063,00.html
Electronics Forum | Thu Apr 22 20:49:01 EDT 2004 | bunmiog
... or this http://www.smtnet.com/express/199908/bgarework/index.cfm?cfid=40896&cftoken=34317412
Electronics Forum | Wed Apr 21 21:50:28 EDT 2004 | adam
Hi I recently having problems on the components having non wetting on the flex circuits. The profile that I am using is according to the solder paste suppiler recommended. Can anyone pls. advise? Regards
Electronics Forum | Wed Apr 28 09:15:15 EDT 2004 | smtpro
Yes we are using a 7 zone and a ramp to spike. How do you handle your solder paste and what printing methods do you use?
Electronics Forum | Wed Apr 28 22:35:32 EDT 2004 | davef
We can clean the blank out of LARGE BGA. [Cleaning small BGA is a whoooole nuther issue.] But before we get into that, what's the problem and its breadth? Why are you getting poor wetting? What's the story on the components, board, process materia
