Electronics Forum: soldered (Page 1216 of 2099)

Collapsing of micro bga ball due to improper land pad design ?

Electronics Forum | Wed Aug 27 00:20:38 EDT 2008 | rameshr

Dear davef, Will u pls advice what are all the possible defects caused while soldering ( assembling ) this type of boards.

Solder not reflowing properly

Electronics Forum | Mon Aug 25 18:24:25 EDT 2008 | dyoungquist

The problem is occuring on more than one part # of our 0402 components. That is why I am looking at the reflow oven process very closely.

Solder not reflowing properly

Electronics Forum | Wed Aug 27 15:48:05 EDT 2008 | grics

Again, our paste manufacturer specifies TAL to be 30-60 seconds. Out of curiousity, how would part placement cause de-wetting? I am fairly new to SMT so elaboration would be helpful... Thanks

Solder not reflowing properly

Electronics Forum | Wed Aug 27 22:39:23 EDT 2008 | davef

Here's a good thread on lead free reflow recipes http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=47575

Solder not reflowing properly

Electronics Forum | Thu Aug 28 22:33:20 EDT 2008 | vladig

Well, as I've said before, a simple cross-section will shed a lot of light on the root cause :-) Vlad www.sentec.ca

Solder not reflowing properly

Electronics Forum | Fri Aug 29 07:39:44 EDT 2008 | realchunks

Slow your conveyor down and see what happens. Your profile looks like you just barely get into the reflow zones you need to be.

problem in solderability

Electronics Forum | Wed Aug 27 17:21:28 EDT 2008 | vladig

Soory, but I don't understand what you are saying/asking. Parts with Pb-free finish existed in the Pb-Sn world, so what is so special about your QFPs? Vlad www.sentec.ca

problem in solderability

Electronics Forum | Thu Aug 28 13:15:59 EDT 2008 | omid_juve

how can i be sure that the device isn`t affected by moisture ? i mean that if the pins are oxidized due to the moisture how can i remove this oxidization ?

problem in solderability

Electronics Forum | Thu Aug 28 15:30:56 EDT 2008 | vladig

We do it on a regular base. You can check out the website below (we are still working on it, though). Regards, Vlad www.sentec.ca

problem in solderability

Electronics Forum | Fri Aug 29 07:56:56 EDT 2008 | davef

Omid It depends. Follow the guidelines of ANSI/J-STD-033, Standard for Handling, Packing, Shipping, and Use of Moisture/Reflow Sensitive Surface Mount Devices. It's available on-line.


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