Electronics Forum | Fri Sep 22 05:33:59 EDT 2000 | Wolfgang Busko
That "C - it doesn�t matter" choice sounds good because it doesn�t give you a headache when profiling but it gives me a headache when I read the article in the current "newsletter" about profiling where I found this: "If soldering to gold over nick
Electronics Forum | Wed Sep 13 14:55:58 EDT 2000 | Mark S
Hi All -- I have read the IPC acceptability requirements of butt-joints, but haven't seen anything on how they're actually performed. I'm assuming we can trim a DIP package, and place the part onto paste immediately before relow (or hand-solder it l
Electronics Forum | Mon Sep 11 09:39:31 EDT 2000 | Chris May
Charlie, Check: a)That your wave is not too high/powerful as this will push up components due to force exerted by mass of solder b)That your conveyor is set at optimimu height so that a) is not required. If conveyor is too high, then the wave will
Electronics Forum | Thu Aug 24 10:44:11 EDT 2000 | James
Ok, here's why we preheat. In my limited experience at our facility I have found that preheating the pallets a half hour before running boards thru the wave helps create a better gasket. We were having problems where the first boards run with the p
Electronics Forum | Thu Aug 10 03:30:42 EDT 2000 | JohnW
Ramon, Solder ball' are a bitch aint they?, identifying the right location to fix em is a bigger one. As you and the rest of teh guy's have said yes you'll need to look at your stenil..but maybe your stencil is good so you'll need to look else where
Electronics Forum | Sat Jul 29 00:44:30 EDT 2000 | Jason
Thanks for all the ideas. I tried solder "thieves" by placing some desoldering wick behind the briging pins and it worked! I have yet to try Chrys' idea but I will first thing Monday. This is a new board that has had this problem from day one. I
Electronics Forum | Fri Jul 28 14:34:13 EDT 2000 | Gary Simbulan
Belive it or not, these boards were run through a Centech batch mode Vapor Phase machine. Single stage top side IR preheat. Vapor temp 218 C. Solder paste is an SN62 RMA.The boards were FR4 8 layer w/ solder mask, fairly conventional as might be e
Electronics Forum | Wed Jun 21 22:07:09 EDT 2000 | Jason
We are going to try double sided reflow for the first time. Can we use the same 63/37 paste on both sides? The board also has bare copper pads i'm pretty sure. will this present any challenges? The bottom side has a QFP on it. Should it stay on?
Electronics Forum | Thu Jun 15 12:57:12 EDT 2000 | Dave F
0.0006" LT Total pad height = Thickness of ( Copper pad + OSP ) = 0.0014" + 0.00000157" = ~0.0014" (You must be using an organic solderability preservative (OSP) or Electroless Nickel immersion gold (ENIG) because 0.003" tin/lead or white tin would
Electronics Forum | Fri Jun 02 16:30:42 EDT 2000 | Michael Parker
I found a reference to Cost of Conversion earlier this year. Basically, the average cost to convert a single component from raw materials to assembled goods is $.08, just after pick and place. After placement and before reflow, repair (solder paste r
