Electronics Forum | Mon Nov 27 08:05:50 EST 2006 | davef
There is no standard for a strain gage measurement of allowable deflection of a board or a fixture. It's possible that your fixture is causing the BGA cracking that you see. What protion of the BGA is cracking? If it is the solder connection, sear
Electronics Forum | Thu Nov 30 09:51:53 EST 2006 | Loco
Thanks for the replies, it is getting clearer now. We called a PCB supplier and acted if we didnt know what was what, he actually told us its all the same, chemical, flash, immersion, all the same... It is now getting clearer why we are sometimes ge
Electronics Forum | Mon Dec 04 20:11:45 EST 2006 | billwestiet
Lots of answers, but none to the question you asked. I don't know of any ppm standards, none would be a good place to start. If you have a particular re-occuring problem with a specific connector or location, e-mail me. bill@ietechnology.net Is t
Electronics Forum | Mon Dec 04 20:57:09 EST 2006 | callckq
Hello, I did EDX on BGA just to find out copper wt% at the package- ball interface. Is wt% ranging from 20 to 32 considered as normal?? As far as I know lead free BGA and solder paste just have little copper..Where is this excess copper come from
Electronics Forum | Wed Dec 06 16:17:31 EST 2006 | Mario Scalzo, CSMTPE
Normally, we try to limit the over print of the paste to the width of the pad on both sides. If you are using 500um pad, then I wouldn't try over a 1500um aperture. Mario Scalzo, CSMTPE, Dartmouth 6 Sigma Green Belt Technical Support Engineer - Ind
Electronics Forum | Thu Dec 07 20:28:07 EST 2006 | davef
When rushing to get a job done, it's easy to accidently remove solder mask from a nearby via when dressing BGA pads after removing the part. Just hit the via with some super glue [then say a small prayer] and push on. As an alternative, look here:
Electronics Forum | Thu Dec 21 13:33:46 EST 2006 | ppcbs
The problem with super glue is that is has a cyanide base that turns into a toxic gas and evaporates when heated. See IPC-7095. Via's should be fully plugged with solder mask at the fab house. If your PCB designers are not up to speed on IPC requi
Electronics Forum | Thu Dec 07 20:00:10 EST 2006 | mgdrouin
Can anyone help me with some information regarding microscopes? I need to purchase several that will be used for fine pitch soldering and inspection. The company is currently using Alhpa ISIS scopes and would like to purchase more of the same type.
Electronics Forum | Tue Dec 12 01:52:05 EST 2006 | hemu_me
As we have vitronics oven(SMR610A) made in dec,1997,which has 5 heating zones and 2 cooling zones. For Lead free soldering what should be our baseline for low/medium boards.we have gathered profiles from various paste manufacturers,however we don't k
Electronics Forum | Fri Dec 15 09:44:38 EST 2006 | mashmo
Hello I am a circuit board designer and just wanted to ask if anyone is seeing the need to alter footprints for ROHS assembly. I also wanted to make sure that I have this particular issue correct. If your BGA is lead free then used solder paste with
