Electronics Forum | Tue Mar 09 20:50:40 EST 2010 | jkhiew
We have encountered high percentage of pin holes issue after lead-free reflow soldering from particular diode supplier that manufactured at Morocco. However, very little reject being found if the particular component is manufactured at China by using
Electronics Forum | Fri Mar 19 00:19:25 EDT 2010 | stevezeva
I've also heard the problem called "Snot-balls". I have a picture: http://stevezeva.homestead.com/Type_4.JPG In my case, this happened because of a bad batch of powder was used when the solderpaste was made. It's happened to me a couple of times sa
Electronics Forum | Wed Mar 24 00:03:20 EDT 2010 | boardhouse
Hi Itzik, it looks like you receive a board from your manufacture that they did solder mask rework on. it looks like they stripped tried to strip the mask off the board. Was this the only board that was like this or did the whole order look like th
Electronics Forum | Thu Mar 25 14:30:29 EDT 2010 | boardhouse
I would not use the product. Solder balls on a massive scale would be one issue due to all the exposed copper. Throw them out, it will be cheaper and less of a headache. I would also question your board shops quality control or lack of for letting
Electronics Forum | Thu Mar 25 12:24:12 EDT 2010 | ssager
When testing components on a PCBA, try to validate coverage for presence, correct, orientation, live, and alignment. AOI is not really great at catching cold solder joints and damaged components, and from my experience an X-Ray is only as good as the
Electronics Forum | Fri Mar 26 15:17:30 EDT 2010 | jooh
Thanks for your replies! So what I understand is that ICT in reality is "only" a production process safety net, but it's a net that in most practical cases is needed. What ICT can not catch is (all) bad solder joints. What are the methods to find t
Electronics Forum | Fri Mar 26 09:00:19 EDT 2010 | krish_bala
Thank you Graham for the response. The particular BGA that we currently Bake is a Level 3 BGA, which means the BGA will expire in 7 days after removal. We are currently baking the BGAs once a week for the problem described above. These devices are u
Electronics Forum | Mon Mar 29 14:39:07 EDT 2010 | cab
I am in the market for a solder paste/flux printer. Presco will do the job , but used cost is $10K. Our pitch is 50 mil on PBGA, so requirement is not so demanding. I found an Innovative Machine model MP-200 for less than $5K. Is anyone familiar
Electronics Forum | Wed Apr 14 10:24:17 EDT 2010 | fönsi
Hello Does somebody of you have some experiences with ultrasonic detectors in SMT-Production? Is it possible to test quality of solder joints by using a ultrasonic detector similar to non destrucitve crack inspection tests? Is there a manufacturer fo
Electronics Forum | Wed Apr 14 14:51:10 EDT 2010 | jgalarza
After checking some of our stencil data for the correct aspect ratio I found that a few are wrong. I would like to change them from 5mil thk to 4mil thk but do not know how much paste volume I need to keep. We are using 0201,0402, and BGA with 0.80 p
