Electronics Forum | Thu Jan 11 00:52:12 EST 2007 | behrsam
Mario, I tried a couple of profiles. In all cases the preheat ramps fairly slow, while the reflow utilizes the radiative heater to speed to reflow as quick as possible. I tried a quick profile and a slower one. The quick has about 15-20 sec at pre
Electronics Forum | Tue Jan 23 10:22:27 EST 2007 | Peter W.
Hello, maybe you are experiencing the so called "head in pillow" defect. It is especially critical for larger BGA. The defect comes from the deformation during reflow of the BGA, so that some of the balls are lifted and have no contact during liquid
Electronics Forum | Wed Jan 17 09:32:09 EST 2007 | Jeff
Hi, I am having problems reworking a lead free PBGA (23mm x 23mm, 1mm pitch). The board is relatively small (5" X 4" X 0.063"). During the removal stage, a thermocouple was placed at the solder ball level (between the board and underneath of compo
Electronics Forum | Mon Jan 29 16:04:29 EST 2007 | BillW
Thanks Russ and John, To clarify defects when manufacturing a PCBA, I use (2) groups of defect categories, one for components and one for solder joints. These can be calculated separately or combined A component defect could be: Missing, Miss-alig
Electronics Forum | Wed Mar 14 09:44:06 EDT 2007 | Cmiller
We use cartridges, that way nobody can mix back in paste off the stencil and no air can get in period. Any paste that is still good to use when removed from a stencil at the end of a job is put into a small pink zip-lock baggy with the date written o
Electronics Forum | Mon Mar 12 08:06:44 EDT 2007 | davef
Q1.� is it mondatory to test all components and paths in the PCBA; and check all soldering joints? A1. Nothing is mandatory. You do ICT to prove some component functionality and check manufacturing process. ICT test coverage is driven by factors i
Electronics Forum | Tue Mar 13 17:29:18 EDT 2007 | Oswaldo Rey
I placed a Maxim MAX16810 38 pin TQFN with a power pad ground on the bottom of the chip on a prototype board FR4 doble sided. Vias of 0.6 mm where placed underneath part, 6 vias in total. Solder was placed with an air operated syringe, land pattern w
Electronics Forum | Sat Apr 14 08:23:29 EDT 2007 | davef
Laser soldering suppliers are: * Seica [low cost firefly A-30]; 45 Osgood St 1st Flr, Methuen, MA 01844; 978-683-8356 F8357 seicatestsolutions.com/pages/24/A30-Firefly-Solder-Station.php; Dave Sigillo [GM] sigillo@seicausa.com * Leister Process Tech
Electronics Forum | Fri Apr 13 10:13:30 EDT 2007 | Bob R.
We had a crisis with one BGA causing huge yield losses due to this defect. Nothing we could do with the profile got rid of it. Changing paste didn't get rid of it. It was the BGA warping in reflow, caused the corners to lift up when the solder was
Electronics Forum | Mon Apr 23 11:49:46 EDT 2007 | ck_the_flip
Wow, you're using the Surface Mount Adhesive for mechanical vibration? I've never heard of SMT adhesive being used for things other than holding the components in place before wave solder. Does it work for mechanical purposes? Glue/Wave is a proce
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