Electronics Forum | Fri May 16 10:06:44 EDT 2003 | pjc
Traceability of raw material, personnel and equipment performance during product manufacture: Tracing raw material is done by recording the material mfg.�s batch-code that they assign during the material�s manufacture. This is everything from the fl
Electronics Forum | Tue Apr 24 09:12:07 EDT 2007 | patrickbruneel
I want to say one more thing on this; many times RoHS is compared to the CFC elimination. But there is a huge difference between the two for following reasons: In late 80�s scientific evidence became available that CFC�s contributed greatly to the o
Electronics Forum | Tue Dec 04 10:30:16 EST 2007 | slthomas
Q: The question I have is do they wet in wave solder, and if they do, why does it matter what happens to them in reflow? A: Yes, but somebody here don't agree with me that the glued part need help from wave to get the good wetting. They are wrong
Electronics Forum | Sun Sep 28 17:14:53 EDT 2008 | ronsou
small pads like 0402 tend to get hot quite > easily. looks like excessive heat is your problem > here. pads are wetted, component leads are not. > this means solder paste flux on top layer was > exhausted before entering in reflow. your profile
Electronics Forum | Tue Nov 11 09:19:17 EST 2008 | davef
By the way you asked the question, we assume that by "reballing" you mean bumping, we should be able to figure that out: * Volume of the ball = ( pi*d^�)/6 = [355/113] *0.6*0.6*0.6]/6 = 0.11mm^3 * Volume of solder required = 2*volume of ball = 2*0.11
Electronics Forum | Thu Apr 15 10:05:50 EDT 2010 | dwonch
Hi all, Long story ahead.... We are having issues with board vendors on some of our higher layer count (thick) boards. Specifically under BGAs with high aspect ratio vias (14:1). We are using ENIG finish and a lead free process. Basically we get t
Electronics Forum | Fri Nov 05 10:59:30 EDT 2010 | methos1979
I have had my system for three weeks now. It is an MV3L. It is running version 4.5.0 build 2.1.2 software and it is very stable. I have not had a single crash. We are not a board manufacturer but rather use our system to inspect both populated an
Electronics Forum | Fri Mar 29 10:11:02 EDT 2019 | cyber_wolf
“For a number of years now, work has been proceeding in order to bring perfection to the crudely conceived idea of a transmission that would not only supply inverse reactive current for use in unilateral phase detractors, but would also be capable of
Electronics Forum | Sat May 08 07:41:00 EDT 1999 | wayne sanita
hello, i have been using up-78 ultraprint for over a year now. at first we were getting lots of solder balls mainly on 0805's. this happened with all paste we used, too much solder under component leads. i have been using apertures reduced 10% homepl
Electronics Forum | Wed Apr 28 11:16:45 EDT 1999 | Steve Gregory
Hello all, I read about Steve's headache a few articles back and I'm really interested by his tip. However, I'm still wondering why square apertures release solder paste better than round ones. For the same volume of paste, the surface area of th