Electronics Forum: soldered (Page 1641 of 2099)

Varistors that leak, political football anyone?

Electronics Forum | Wed Jul 12 09:45:16 EDT 2000 | Charlie

The following are questions my boss has ask me to send out to you folks. This is done in an effort to see "What does the rest of the world do?" [if such a world could possibly exists, in the first place]. If you would select any or all questions to r

Re: Screen printing glue for wave soldering SMT components.

Electronics Forum | Fri May 26 05:54:40 EDT 2000 | Sal

For the past year now we have been printing adhesive with no real problems. Our printing ranges from 0603's to SOIC using a variation of aperture sizes and metal thickness foils. The crucial parameters are : aperture sizes : These obviously depend o

Re: Dusted By Dross -what a wake-up

Electronics Forum | Thu May 18 21:46:21 EDT 2000 | Dave F

Scott: First, it's neat that you do cartridge monitoring on you staff. We do that once a year. We (and I assume others) are responding to OSHA requirements: Lead CFR 1910.1025 permissible exposure limits for lead, provisions for medical examinati

Re: Paste Dispensing

Electronics Forum | Wed Feb 23 16:49:08 EST 2000 | Dave F

John we paced through the same question recently. Both automatic dispensers and printers can be used to deposit SMT adhesive or solder paste on substrates with a relatively high component density. Dispensers are superior to printers in terms of exa

Underfill Inspection Criteria

Electronics Forum | Thu May 31 10:21:16 EDT 2001 | davef

On "Flip Chip/uBGA Under-fill Visual Standards" � The third "Satisfactory" [The under-fill if by design should be visible � ], here the notation "if by design" is unclear. Does "according to product documentation" get to the point? The first "Acc

Re: Handling of Moisture sensitive devices

Electronics Forum | Thu Jan 27 20:34:12 EST 2000 | Dave F

Ashok: The real concern about moisture sensitivity is in plastic packaged parts. The plastic packaging used to manufacture surface mount technology devices absorb moisture from the environment. The high temperatures involved in vapor phase/reflow

Re: Reflow parts moving

Electronics Forum | Wed Sep 08 21:32:46 EDT 1999 | Jason Nipper

| | | | | | Hello: | | | | | | We are using a Heller 1500S reflow oven to solder surface mount parts. Just within the last two weeks, the larger I.C.'s are moving while going through the oven. The parts are checked for placement before putting

Re: Reflow parts moving

Electronics Forum | Sun Sep 12 10:51:04 EDT 1999 | K.T

| | | | | | | Hello: | | | | | | | We are using a Heller 1500S reflow oven to solder surface mount parts. Just within the last two weeks, the larger I.C.'s are moving while going through the oven. The parts are checked for placement before put

Re: Proflow of DEK screen printer

Electronics Forum | Tue Sep 07 15:28:13 EDT 1999 | Earl Moon

Listed below are the issues Viking has been experiencing since the installation of the Proflow Head: 1. After installing new 350mm Wiper foil with metal strip glued on it, It worked for about a week and suddenly metal stri

Re: Proflow of DEK screen printer

Electronics Forum | Wed Sep 08 08:25:26 EDT 1999 | Brad Kendall

Listed below are the issues Viking has been experiencing since the | installation of the Proflow Head: | 1. After installing new 350mm Wiper foil with metal | strip glued on it, It worked for about a week and suddenly meta


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