Electronics Forum | Tue Apr 07 13:17:10 EDT 2009 | tserra
I would recommend looking at SAKI/MacroScience. http://www.xraytechnology.eu/index.php?option=com_content&task=view&id=34&Itemid=42 I have seen the images created by MSX3000 from MacroScience which is now under SAKI and can tell you with certainty
Electronics Forum | Mon Mar 30 20:22:31 EDT 2009 | 89jeong
Thanks for your answer. For your question, this problem first happend on board with components so,we tested a board without components. As you said(only your case),if i inform our supplier, i will not get any answer from him and this will be very
Electronics Forum | Tue Mar 31 05:26:14 EDT 2009 | d0min0
Hello, we had similar problem in the past - when we had to change PCB supplier from a batch of hundreds of boards (NiAu plated, SnPb process) we got 2-3 boards with paste wicking to components leads what we did, was to check the thickness of gold on
Electronics Forum | Thu Jan 29 06:29:33 EST 2009 | sachu_70
There are two profiles available for the Pb-free process: (1) RSS and (2) RTS. In your case, you should try a solder paste that supports RTS profiles. A minimum of 7 zone Refow Oven would be fine on the Pb-free process. However, you may still try by
Electronics Forum | Mon Feb 02 11:57:39 EST 2009 | allwave
Hello everybody, We are running a product through wave solder process using three different PCB suppliers. I have noticed that you can see more flux residues (water-based, No-clean flux) on one supplier than on the other two. All three PCBs run unde
Electronics Forum | Tue Feb 03 03:57:37 EST 2009 | sachu_70
Hi George, I would suggest you to re-look your process parameters, especially for the pre-heat temperatures and the amount of flux deposited. The mask properties and that of your flux also play a role, but you could zero down to the root cause after
Electronics Forum | Wed Feb 04 08:49:52 EST 2009 | milroy
Hi First of all you have to respect the dwell time and the time after the reflow at peak tmeperature.(225�C for Pb and 235�C for Pbf) You can find the reflow profile from manufacturer for majority of parts designed for reflow sodlering. In general t
Electronics Forum | Tue Feb 10 02:14:39 EST 2009 | emmanueldavid
Smartasp, Seems this issue is certainly making a long thread ! As far as our Experience is concerned on Reflow Soldering, particular parts must have failed in LSLs [Lower Specification Limit] and have not withstand well under USLs [Upper Specificat
Electronics Forum | Wed Feb 04 03:30:56 EST 2009 | smartasp
Hi All We intend to switch fro SAC305 to SN100C, which has been giving us great test results. Unfortunately we have a technical guy at head quarter, which refuses to accept the SN100C as it has a 10 deg C higher melting point as SAC. I argue besides
Electronics Forum | Wed Feb 04 08:28:07 EST 2009 | milroy
Hi, I have done conversion from SAC387 to SCS7 with great results on process improvement with low cost. I see only the melting point is higher but still the solder pot temperature settings is 250�C to 260�C as SAC. If somebody think the temperature
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