Electronics Forum | Wed Jul 20 03:10:45 EDT 2011 | umar
I have mount the 8 pcs SEVEN SEGMENT LEDS on the PWB side at SMT Process, after reflow the board test at customer side and facing some issues which is missing segment and also one segment founded dimmers compare to other segment. Data sheet of LEDs
Electronics Forum | Thu Jul 28 07:23:24 EDT 2011 | scottp
My group supports a couple hundred lines all over the world. Most of them use squeegees but a few use either the MPM Rheometric pump heads or the DEK Proflow heads. I absolutely hate the enclosed heads. Flux separation, compaction, and the print q
Electronics Forum | Thu Aug 04 20:35:33 EDT 2011 | zywong
Hi All, I'm facing a problem is the PCBs are having delamination issue which after SMT reflow process & wave solder process. Dose anybody faced this issue before? The profile setting are correct settings. Some question i wonder: 1) Is that long time
Electronics Forum | Fri Aug 12 17:36:06 EDT 2011 | grics
Dave is correct. Also, you should check the TDS's of the caps and the display before processing to see if they can withstand the process temps, look for a recommended solder profile or info for the manufacturability of the device. On another note,
Electronics Forum | Sat Aug 13 10:56:57 EDT 2011 | jldowsey
Process Flow #4 in davef's response is your best bet for this assemblly judging buy your pictures. We purchase our selective wave solder pallets from Ascentec Engineering - they can fabricate a pallet to hold your assemblies, keep the SMT devices pro
Electronics Forum | Wed Sep 14 15:42:45 EDT 2011 | nowak18
During temperature cycling we have determined that the conformal coating wicking underneath our BGAs has caused fractures in our solder balls. One proposed solution is to run an RTV dam around the parameter of the BGA to prevent the CC from wicking u
Electronics Forum | Thu Sep 22 14:25:13 EDT 2011 | hegemon
Dave has stated the caveats well. I too have similar experience in reworking BGAs that mirrors your own. The only situation where I saw this as an issue, was in memory devices where a row of BGAs might share a commonm heatsink. In those cases the
Electronics Forum | Mon Sep 26 14:05:04 EDT 2011 | scottp
I agree that class III is overkill for most applications and the customer needs to pay for it if that's what they want. It's also true that class III doesn't assure things won't fail. Life expectancy is mostly due to component and material selectio
Electronics Forum | Tue Sep 27 09:43:38 EDT 2011 | dyoungquist
I did not mean to imply building to class III would prevent failures. Since there seemed to be a little confusion about the classes I threw that out to show that class III was a higher standard. I also agree that while re-work can fix a class III d
Electronics Forum | Thu Sep 29 17:42:49 EDT 2011 | action_101
I used Indium WF-9940 at the last place I was at for 5 years. We ran leaded and lead free product in our ERSAflow selective soldering machine with that flux type. It worked good for both applications. The place I am at now we have an Ersaflow selecti
