Electronics Forum | Thu Jul 12 17:43:50 EDT 2001 | Steve
In order to understand your printing process, you cannot rely soley on 2D inspection. By implementing 3D-true volumetric measurement, a more comprehensive approach to correcting the process variation can be established. True volumetric / 3D inspect
Electronics Forum | Thu Jul 26 13:17:45 EDT 2001 | Hussman
Most solder paste manufacturers will take a reasonable amount of paste back, just so they won't loose your business due to bad paste. But if you're asking to ask to ask - separated paste from flux is not a bad thing if the jar was never opened. Pas
Electronics Forum | Mon Jul 23 20:18:18 EDT 2001 | davef
Prasad�s book, that an earlier poster mentioned, is good, but other books to consider are: * MacLeod Ross �Guide Design & Manufacturing V1 & V2� Electrochemical Publications * Wassink & Verguld �Manufacturing Techniques For Surface Mount Assembly� El
Electronics Forum | Tue Feb 01 07:50:25 EST 2000 | Jason Bentley
This all depends on the mixture of your solder. If you are using water soluable flux then it will get clean. But not alcohol based flux. As for using the ultrasonic this might be a problem I personally have never heard of someone washing a board in a
Electronics Forum | Mon Jan 31 13:34:43 EST 2000 | PAUL WOOD
HELLO CUSTOMERS OF OK LATEST INFORMATION UPDATE WITH REFERENCE TO OLD BGA 2000 MACHINES WHICH ARE NOW 6YEARS OLD MANY NEW INVENTIONS WHICH HAVE TAKEN PLACE CAN BE PURCHASED FROM METCAL TO BRING YOU TO THE FOREFRONT OF TECHNOLOGY.(PATENTED TO ) BGA 30
Electronics Forum | Tue Jan 25 13:15:17 EST 2000 | Michael Allen
Thanks for the input Mike (and others). As you guessed, via-in-pad is not my idea, and I'm resisting it as much as I can. One of our designers used this practice at some other company, says there were no problems, and wants to use it (via-in-pad) a
Electronics Forum | Sat Jan 08 11:12:49 EST 2000 | S. Evers
Hi all, Best Thing Since Sliced Bread? No doubt many of you have seen Phil Zarrow's "over-the-top" review in Circuits Assembly of the new Ersa scope, a device that allows viewing a really neat close up a side view of the component substrate interface
Electronics Forum | Wed Jan 12 20:20:54 EST 2000 | Bene
I had the opportunity to spend time with a demo and one on one with the inventor of the Ersa scope inhouse a few months ago. I see the scope complimenting X-ray inspection but not as a substitue. It allows you to view attributes of a solder joint t
Electronics Forum | Tue Dec 28 10:57:53 EST 1999 | Amy Castor
I have tried the water soluble flux and the aqueous cleaners but I got the same results you did; horrible corrosion and a white flaky mess. I know exactly what you're talking about. We do a lot of hand soldering around here, and the magical solutio
Electronics Forum | Thu Dec 16 16:46:47 EST 1999 | Mike Naddra
Steve , I use a general set of guidlines when developing reflow profiles: Ramp rate to 140 deg C - 50-60 seconds Time at preheat (140-160 deg C) - 90-120 sec Time above liquidous (183 deg C) - 45-90 sec Time at peak (215-225 deg C) - 9-12 sec peak t