Electronics Forum | Thu Jan 03 08:02:53 EST 2002 | davef
Slump is a function of the particular paste you select and the temperature of the paste. Use a slump test like the one that follows to compare fluxes. Slump Test Step Process activity 1 Print paste on white ceramic substrate or microscope sli
Electronics Forum | Wed Jan 16 07:49:14 EST 2002 | Yannick
Hi, In few weeks I want to test the capabilities of our SMT Line. To do that I'll design a board. I want to test: - The Printing - The component placement - The soldering - Different stencil aperture - Mixed Technology (Thr
Electronics Forum | Mon Jan 28 08:07:44 EST 2002 | JohnW
Sorry I keep forgetting you lot are backwards in the old metric system :0) anyhoo, yes IPC, the bastions of right well as long as your board is only 1.6mm thick (sorry 62mils)say that you need 75% min general and 50% on ground planes. I'd like to se
Electronics Forum | Mon Jan 28 19:58:58 EST 2002 | davef
Well, reflow certainly would increase your preheat, wouldn�t it? On the other hand, some PTH [and SMT] components cannot bear the heat of a reflow oven. Some boards will never see proper barrel fill, because of either: * Design of the board. * Sl
Electronics Forum | Thu Jan 31 07:02:00 EST 2002 | martino
The whole process counldn't be easier. The sales reps' try to turn the whole thing into some crazy black art-its not. The stencil supplier will have their own standard 'glue dot' configurations, and 9 times out of 10 these are more than adequate. As
Electronics Forum | Mon Feb 18 17:27:03 EST 2002 | hgwells
Agilent has a great article on determining whether automated optical inspection (AOI) or automated x-ray inspection (AXI) is right for you. It's a PDF file that can found here: http://www.ate.agilent.com/EMT/LIBRARY/X-RAY/DOCS/59883661en.pdf To sum
Electronics Forum | Thu Feb 21 10:13:27 EST 2002 | Vince Whipple
Hi Dave G, This is an interesting problem.. I can only add the following: - Try trimming the pins and see it this helps.. sometimes the decreased surface area will lessen the surface tension enough to minimize the effect of bridging. - As Dave F was
Electronics Forum | Thu Feb 28 05:21:31 EST 2002 | Andrew H Otwell
Hi, I'm helping to design a website and database of product information for the packaging and SM industry. We're at an early stage, and I'm interesting in learning as much as possible about how people like you (Design/Dev. Engineers, Researchers, or
Electronics Forum | Thu Mar 07 15:42:34 EST 2002 | bdoyle
Sorry about creating a new thread, but I wanted to make sure that this didn't get buried. I was sent the files and have posted them to the library. http://www.smtnet.com/library/index.cfm?fuseaction=view_article&article_id=1077 There are three fil
Electronics Forum | Tue Apr 09 07:41:08 EDT 2002 | johnw
Craig, it depend's n what you want to look at. In term's of te gran structure of the solder jont that's formed when the joint is cooling so you'd want to monitor the temperature drop from the peak or say 215dg C for ref down to probably about 150 an
