Electronics Forum: soldered (Page 1981 of 2099)

Re: more detail

Electronics Forum | Wed Jan 19 11:31:58 EST 2000 | Dave F

You said: "how come do i calculate the money for one chip mounting. I really want to know that. Maybe someone already has it. Shortly speaking , CALCULATION EQUATION FOR 1 CHIP MOUNTING COST IN SMT PROCESS." So, I gave you equations for calculating

Re: Poor solder joints on QFP 100's

Electronics Forum | Mon Dec 13 19:34:09 EST 1999 | Steve Thomas

Thanks, gentlemen. All points well taken, and some hit pretty close to home. Our pick-and-place programmer assures me that coplanarity isn't the issue because the machine won't (or can't) place parts beyond an acceptable criteria. It's an Amistar

Re: no-clean processes - are gloves necessary?

Electronics Forum | Thu Oct 21 09:56:11 EDT 1999 | Brian

Rich An excellent question and one which is often totally ignored. If you wish a "no-clean" flux to be as safe as it possibly can be, the PCB and the components must all be contamination free (ionic and non-ionic). Only then can you be sure that the

Re: BGA solder joints versus mechanical stresses

Electronics Forum | Thu Sep 02 16:52:31 EDT 1999 | Earl Moon

| | | Has anyone done or seen any studies done documenting what may be the affect of hardware such as screws in the parimeter vicinity of BGAs on a circuit board? | | | | | | What I'm really after is anything describing how close a screw/washer/nut

Re: No-clean stencil apertures

Electronics Forum | Thu Aug 26 04:35:54 EDT 1999 | Wolfgang Busko

| | | Does anyone have any information on stencil aperture/pad ratios for noclean solder paste. In the past I have experienced severe solder ball problems when using the same size apertures from aqueous products as I do with the No-clean products.

Re: Cylindrical diodes Missing during SMT process.

Electronics Forum | Tue Aug 24 06:40:18 EDT 1999 | Gyver

| | | Hello everyone, | | | We found many cylindrical diodes missing during SMT process. Could someone tell us how to prevent this problem? Is it effective to change the shape of stencil apture or reduce fan speed in reflow oven? Thanks in advance. |

Re: Cylindrical diodes Missing during SMT process.

Electronics Forum | Tue Aug 24 11:36:37 EDT 1999 | Jimmy G

| | | | Hello everyone, | | | | We found many cylindrical diodes missing during SMT process. Could someone tell us how to prevent this problem? Is it effective to change the shape of stencil apture or reduce fan speed in reflow oven? Thanks in advanc

Re: De-wetting

Electronics Forum | Thu Aug 19 19:04:55 EDT 1999 | Brian Wycoff

| | Can anyone help on the subject of de-wetting during the spray coating process. We use PC29M Parts A+B spray coating material, Humiseal tapes and masking dots, Marigold supertouch V70N gloves and Concoat CM533 liquid masking material. We also use

Re: Bare Copper Pad Reflow Soldering

Electronics Forum | Fri Jul 30 16:02:49 EDT 1999 | Earl Moon

| | I received a request from customer to assemble ceramic substrate (alumina oxide)that printed with a low temperature Copper thick film conductor (the overglaze layer is polymer). The Copper pads are exposed without any coating. | | This ceramic su

Re: Ghost circuit shorts under smt resisters only when they are located on solder side of pcb (glued down)

Electronics Forum | Fri Jul 30 09:43:44 EDT 1999 | C.K.

| We are having a process related problem with pullup resistors on a controller card which has a I960 micro-processor. | The controller monitors signal inputs and it's own resources then blinks a LED to indicate its working. The problem is that after


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