Electronics Forum: soldered (Page 2006 of 2099)

Leadless Leadframe Part Manufacture Issues

Electronics Forum | Tue May 22 17:24:12 EDT 2001 | davef

What is your thinking on the issues surrounding design and manufacture with leadless leadframe [eg, land grid array, micropak] components beyond those in http://www.national.com/ads-cgi/viewer.pl/an/AN/AN-1187.pdf? The curve ball that we just looked

Bottomside SOT23 opens & DOE test board layout

Electronics Forum | Thu May 24 16:45:57 EDT 2001 | kmorris

Hi All: We�ve got a problem here with opens on bottom side wave soldered SOT23s. Based on past experience and review of the SMTnet archives, I feel that our main problem is pad size. We have the same size pads for bottom side SOT23s as we have for

Pallet absorb thermal heat : compensate by higher deg-C?

Electronics Forum | Sat Jun 09 00:53:34 EDT 2001 | ianchan

Hi Folks, My Production runs a uBGA-liken product, and uses Pallets to support the 0.8mm thick pcb, during the SMT + reflow oven process. Process/QA see occurs: 1) 0402 unsolder? 2) 0402 tombstone? 3) "uBGA" poor-visual joints (dry joints)? Took

Reflow Oven vs 0402 Tomb Stone

Electronics Forum | Sun Jun 10 12:15:37 EDT 2001 | procon

Hello Danial, Leave it up to most to blame the relow oven for their tombstoning problems when in fact it is usually the last to cause it. The biggest culprit of tombstoning is the pad design followed by the print quality. Usually, we find that the p

Rheopump vs. squeegee

Electronics Forum | Wed Jun 13 13:50:49 EDT 2001 | DaveG

I don't have any actual "hard" data to give on improvements but, I can share some experiences with you. What we noticed when we implemented the Rheo pump was: No more solder "skips" on our boards, Improved print quality on our BGA's & 16mil fine pitc

Wire for PCB modifications

Electronics Forum | Thu Jun 14 21:09:44 EDT 2001 | davef

I bet ya box of Krisp Kremes our operators can melt insulation on wire better and faster that yours can!!! Aww, our operators can melt any insulation on any wire. It�s taken years of effort to develop the talent, but not matter what we bring in for

Wire for PCB modifications

Electronics Forum | Fri Jun 15 06:07:01 EDT 2001 | wbu

To expand on that, the melting stuff does work quite well with us if we intend to melt the insulation but luckily our "solder slaves" want to be proud of their work and manage to not melt even the worst material they are confronted with. I somehow ma

Gil

Electronics Forum | Mon Jun 18 15:42:32 EDT 2001 | Gil Zweig

Transmission x-ray inspection is the technique most people are familiar with. Since materials will absorb or transmit x-rays as a function of their atomic number and thickness, the transmission x-ray image provides a two dimensional represenation of

Recommanded profile for 0402 & 0201.

Electronics Forum | Mon Jun 18 13:29:34 EDT 2001 | nifhail

What is the recommanded profile for board which consist of 0402 & 0201 comps. to reduce the effect of tomb-stone. Slow ramp rate ? how slow is considered as slow. Soak time 60 or 120 C,at which end should I stick to? what is the best time before reac

Mixing no-clean solder with activated

Electronics Forum | Wed Jun 27 21:17:37 EDT 2001 | davef

;-) Earth to Genny: Hellooooow!!! No one knows the answer. We�re guessing that it might not be a problem, but we don�t know!!! We are not holding-out to drill you. We�d tell you, if we knew, honest. ;-) The people that are goofy enough to do


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