Electronics Forum | Thu Apr 09 12:25:43 EDT 1998 | Dave Hammond
I am currently involved in a reliability project related to SMT QFP and TSSOP fine pitch solder joint reliability. I have decided to use a temp chamber for stress testing. Is there a test standard that covers this? I am also a bit unsre as to whether
Electronics Forum | Sun Apr 05 19:02:34 EDT 1998 | Graham Naisbitt
Peter, Take a look at IPC-ANSI J-STD-001A and B, J-STD-004 and I think, 005/006 which cover solder paste (?) I think. Whatever, they do reference one another. | Question: Whatparameters are used to determine "good" Solder Paste? What reference doc
Electronics Forum | Thu Feb 19 16:02:49 EST 1998 | Gary Simbulan
I have been involved in SMT for only a few months so I am coming from a position of extreame ignorance. I have been asked to investigate the differences in soldering to components with Paladium coated leads vs the standard Tin_lead. I would appreci
Electronics Forum | Mon Feb 23 13:25:21 EST 1998 | Steve Gregory
Steve - you must not work to IPC class 2 or 3 requirements. If the solder is "pillowed" around the lead, I would strongly suspect a wetting problem. Most of the Paladium leads I see soldered have a strong line of demarcation but no pillowing. Hav
Electronics Forum | Fri Feb 13 03:26:07 EST 1998 | Brian S. Bentzen
Hi , The 4th stage in reflow soldering, the cool-down, I find is often over looked. A rapid cooling rate should give finer lead and tin structure with more bindings and thereby result in stronger solder joints. Can anybody give me some information
Electronics Forum | Tue Aug 14 17:09:37 EDT 2001 | davef
Dano's confused. The boards are delaminating during soldering. The delamination just isn't immediately appartent after soldering. Stepping backwards. It's remotely possible that if the boards were blistering hot from soldering and then dumped in
Electronics Forum | Fri Aug 17 10:01:50 EDT 2001 | Hussman
Howdy All, Just want to know if solder pre-form really work. Any pit falls? Looking to solder a through hole connector (70 pin) in a 0.062" PCB with 10 zone convection reflow oven. My biggest worry is getting enough wetting on both sides of the b
Electronics Forum | Fri Sep 14 15:31:02 EDT 2001 | davef
How in earthly heaven would someone else have a report analyzing the defects on your boards? Among the good failure analysis labs that can assess situations like yours are: * Robisan Laboratory 6502 East 21 St Indianapolis, IN 46219 317-353-6249 fax
Electronics Forum | Sun Sep 30 00:54:06 EDT 2001 | chinaman
Has anybody heard about solder wires for rework with a V-notch in order to avoid solder balls which might be caused by shooting flux when getting hot. The notch is as deep to reach the core so that the flux can expand easily. I can imagine the effect
Electronics Forum | Mon Oct 01 03:46:57 EDT 2001 | wbu
Have never heard of solderballs during rework using solder wire. Noticed the tendency to have little balls of flux with too hot iron and lots of solder used for shields or massive cables to be connected. Seems to me a question of believe if it does
