Electronics Forum | Tue Mar 15 08:02:36 EDT 2011 | davef
Yes, you can reflow solder SMT parts with pads designed for wave soldering [including 1206] providing that you design your stencil apertures properly. It's a momma, poppa, baby bear situation. * Wave solder sized apertures will put too much paste on
Electronics Forum | Fri Mar 25 10:50:01 EDT 2011 | grahamcooper22
3 deg / sec) then the flux can slump from the paste and solder is carried with it off the pad and will form balls. Finally, are your pcbs dry ? Pass a bare one through the reflow oven before you print any paste on it, let it cool and then process as
Electronics Forum | Thu Apr 07 09:26:03 EDT 2011 | alcatel
Im trying to get the XY data to program the SMT machines. since i dont have the file, im trying to convert it from the gerber drawing. the closest one to represent the component placement is the solder pad. ive tried using linkcad to convert it to XY
Electronics Forum | Thu May 26 07:50:33 EDT 2011 | scottp
What process steps have been completed before the cross-section? What type of devices have solder cracks? Are the cracks found after just normal processing or after some type of validation testing? It is very unlikely to be a heating/cooling issue
Electronics Forum | Wed Jun 01 15:50:59 EDT 2011 | markhoch
I don't believe that particle size of the solderpaste will offer you any relief from this issue. The solder flows into the via, leeching away from the desired solderpoint, after the solder has become liquious. The chemical make-up of the solder contr
Electronics Forum | Fri Jun 10 13:04:04 EDT 2011 | spitkis2
Any suggestions as to what can cause a PBGA's corner to warp down during installation process on a rework system? A couple solder balls bridge at the corner. It appears at the pin 1 corner where the metal indicator of a BGA is exposed. I am wonder
Electronics Forum | Wed Aug 10 15:45:49 EDT 2011 | franxsmt
Maybe I was not clear in my original post. So we have boards that have SMD components on one side and TH components on the opposite side. We want to assemble the boards using our SMT and Wave lines. Now the problem is that if we solder the SMD firs
Electronics Forum | Fri Sep 16 05:29:34 EDT 2011 | jacki
This looks like a flux problem to me. I would > check the specific gravity of the flux. Also > check the thermal profile of th e wave solder > process. Hi Mosborne Thanks for your sharing. But, we use the same flux and wave profile for other pr
Electronics Forum | Mon Sep 12 10:41:50 EDT 2011 | processmxli
Hi All We have run SMT process with SnPb but we’re installing some lead free components like capacitors and resistor lead free. After the reflow oven all components have good appearance with solder join sheen. But the lead free components the solde
Electronics Forum | Mon Oct 03 15:13:00 EDT 2011 | tombstonesmt
It sounds to me that it's a heat transfer issue. The solder is only bonding to the lead on not the barrel correct? Does your selective solder equipment have any type of heating source? Can you "dwell" on that particular joint? On some of our products
