Electronics Forum | Tue Jun 13 04:20:21 EDT 2006 | Grant
Hi, ok, I have a bit more info after playing further with the profiling. We are getting close, but we don't have enough top side heat I think. The IR lamps just don't give enough, but we can get better connector that should help. But we have anoth
Electronics Forum | Tue Jul 18 18:53:23 EDT 2006 | Mike F
Is it showing up after wave or reflow soldering, or after hand soldering? If the delamination or blister bridges between traces you have the potential for a short circuit between those traces. A delamination might be repairable, but in most cases i
Electronics Forum | Wed Sep 20 10:36:27 EDT 2006 | proy
I am considering moving my spray fluxer into a completely separate operation. Has anybody any comments of sraying VOC free flux on boards, then putting them in a drier/holding rack for possibly say overnight, then running them through wave solder?
Electronics Forum | Wed Sep 27 23:52:28 EDT 2006 | fctassembly
Hello Steve, Yes, there are differences in the various alloys and I have described briefly below these differences: SN100- a common name for 100% tin that is used to increase the tin content in 63/37. SN100C-Name for Tin/Copper/Nickel/Germanium all
Electronics Forum | Tue Oct 03 18:41:16 EDT 2006 | C.K. Flip
With recent implementation of VOC-Free flux in our shop, we've experienced little solder fines/balls on the above combo of VOC-Free, Water Based, and glossy to semi-glossy mask finish on PCB's. The solder balls show up on close conductor spacings, ~
Electronics Forum | Mon Nov 27 22:19:13 EST 2006 | ppcbs
800 degrees? Ouch! I find that every company that I do training for has at least one person that likes to go through one tip a day. The solution is tip tinning. Tell your operators to wipe the tip on a damp sponge often. Do not buy your sponges
Electronics Forum | Fri Nov 17 19:28:36 EST 2006 | rob@spinpcb.com
What kind of board finish do you have? You describe solder bubbles...and when you remove them, you find open vias. Are you, by chance, discovering flux contained in these bubbles? We've been experiencing the same thing with pb-free soldering on a
Electronics Forum | Wed Nov 29 10:10:50 EST 2006 | M. Sanders
I'm sorry, Dave - I didn't make myself very clear. Yes, this space (not really a "gap") is filled with solid solder. For instance, if you place a gull-wing component in solder paste, after reflow, there will probably be a thin film of solidied solder
Electronics Forum | Tue Jan 16 16:59:39 EST 2007 | realchunks
Pallet angle is usually pretty good. Lead length is also another good thing to keep as short as possible. Air Knives don't work that well. Also check your board. Make sure you have solder resist between each and every thru-hole pad. If the board
Electronics Forum | Fri Jan 19 04:12:37 EST 2007 | AR
Hi I know that pump stencil technology can be used to print adhesive on boards with TH components already placed and clinched, but what about solder paste? The production sequence goes like this: First the jumper wires are placed and clinched with
