Electronics Forum | Thu Nov 08 13:17:17 EST 2007 | mattkehoe
Yes, we just wanted to make sure we weren't missing anything. Thanks for the feedback. mk
Electronics Forum | Fri Nov 09 06:49:56 EST 2007 | mattkehoe
Thanks to all. We appreciate your feedback. mk
Electronics Forum | Sat Nov 10 21:15:04 EST 2007 | mika
make 4 square rounded corner apertures around the ground pad and the total reduction of 20 % (80 % solder paste). Then you still be able to solder the terminals around. We SMT-mount & reflow soldering various QFN packages onto our customers pcb:s wi
Electronics Forum | Mon Nov 12 09:22:41 EST 2007 | devajj
BTW, The surrounded QFN fine pitch terminals > should have the normal aperture reduction of 7 % > in case of RoHS Senju solder paste. This works > for our Telecom customer. > > The vias in the > ground pad will be somewhat filled with solder >
Electronics Forum | Mon Nov 19 14:23:32 EST 2007 | realchunks
BINGO! Now that's engineering!
Electronics Forum | Wed Nov 14 10:51:34 EST 2007 | mumtaz
Yes. Baking boards is best. Hitting the hamer on the head!
Electronics Forum | Tue Nov 27 19:41:53 EST 2007 | g2garyg2
Well, there seems to be many opinions, many of which could be correct, however... With the proper laser they can be quite good for soldering. Here are a few guidelines I would like to suggest. 1) Have your product soldered first (by the vendor) 2) T
Electronics Forum | Mon Nov 26 10:36:19 EST 2007 | davef
Sure, if you slopper or schmush chipbonder onto pads, solder will not take on that portion of the pad, regardless of the component.
Electronics Forum | Thu Nov 29 15:08:56 EST 2007 | jaimebc
Shy, You mentioned that you are using "dog bone" apertures for your chip components? It doesn't make sense to me. I thought that the "dog bone" was used for fine pitch devices, to keep the solder away from the center and avoid bridging. It doesn't
Electronics Forum | Thu Dec 06 12:21:45 EST 2007 | realchunks
You say designing for the processes is good.
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