Electronics Forum | Fri Apr 07 16:04:34 EDT 2000 | John
Anyone out there using solder paste (dispense) on through hole technology parts? I would like to know how it's working out for you. Which method or technique are you using? Have you ever tried to dispense on the component side and place through the d
Electronics Forum | Sat Mar 25 12:13:13 EST 2000 | JAX
Robert, Have you checked for any form of contamination that might cause the solder not to adhere to the balls? From the pictures you have on the net it appears that you have too much solder on the pads. What thickness is your stencil? If it is to sp
Electronics Forum | Sat Mar 18 07:33:34 EST 2000 | Dave F
Jack: Two concerns with column devices: 1 Coplaniarity of the device and the board. 2 Adequate solder that you mentioned, becuase the columns will not be reflowing and you need to cloatthem with solder. You didn't describe your aperture, but even
Electronics Forum | Wed Mar 15 01:20:08 EST 2000 | Dreamsniper
Do we really need not to locate vias underneath discrete components on a PCB that will be wave soldered after reflow even though we are using no clean process on our wave solder ? What are the possible cause and effect when locating Vias under discre
Electronics Forum | Fri Mar 03 09:05:59 EST 2000 | Istv�n Dominik
I received data sheets from a paste distributor in which Amtech gives a recipe how you can mix solder cream. They deliver the flux in plastic jars and the solderpowder in foil packages. You must mix the two components with a simple mixing tool. Has a
Electronics Forum | Thu Mar 02 15:20:13 EST 2000 | Glenn Robertson
Dave - You certainly have a good point regarding the multiple part numbers and board suppliers, but a rework process for black pad has been reported. See the SMTAI 1999 Proceedings article by Zequn Mei (page 407). It involves flux and solder wi
Electronics Forum | Thu Mar 02 21:17:41 EST 2000 | Dave F
Dave: It's good to know what that stuff is. With your NiO, you have the typical ENIG problem. I can imagine some causes for your disaster: * too thin gold plating * oxidized nickel under gold plating * porous nickel plating * wrong soldering pr
Electronics Forum | Fri Feb 25 16:04:18 EST 2000 | Dave F
Sze-Pei: Are talking BGAs here? Flux type? Profile? Pad material? Aperture size? We won�t want to give people too many hints on what the problem is would we? BGA voiding is a function of materials, methods, environment, and human factors. Con
Electronics Forum | Thu Feb 01 20:21:34 EST 2001 | huat
Hi, Currently, we use kapton tape to tape out the goldfinger at our area. We still experience solder at goldfinger area, suspected is from washing of misprint boards. Can someone advice me on what is the method being use to clean the goldfi
Electronics Forum | Mon Feb 05 20:33:14 EST 2001 | davef
Could you be trying to find: Stevens Products 128 N. Park St E Orange, NJ 07019 973.672.2140 Ross Stevens? Dynamic Technologies (titanium cover w/ silicone jacket, pricey) Stevens makes a U-shaped strip of fiber-material that slips over gold fing