Electronics Forum | Tue Jul 31 10:41:49 EDT 2001 | ronho
I'm interested in process information from someone who has experience with this package, such as pad design, stencil aperture dimensions, stencil thickness, unique issues, profiling, solder paste. Design is considering this package for future produc
Electronics Forum | Mon Feb 07 13:00:06 EST 2000 | Jose RG
Hi, Last Friday, we had a new defect in our line. We found a nice and shiny solder fillet completelly attached to some component leads (in a SPLCC 84) but the solderjoints were not solder to the pads. (Hasl finishing) Any idea ?? Some contamination
Electronics Forum | Tue Feb 08 03:14:37 EST 2000 | Roni H.
Hi Jose, J-lead are very sesitive to coplanarity, which is the major cause for the defect you described. Other posibility is that there is not enough solder paste ; J-lead need around 10% more solder past then L-lead, You have to consider the screen
Electronics Forum | Sun Feb 06 07:37:29 EST 2000 | Dave F
Albert: Several points: � Bi should have no effect on your no-clean. The flux you select with your Pb/Sn/Bi wire solder could be an area for concern tho. � Bi will form an alloy with Pb with a melting point of 93�C. � Look at "Process Change - Rya
Electronics Forum | Wed Jan 26 14:33:47 EST 2000 | Glenn Robertson
Tuan - How about Sn/0.7Cu? It's M.P. is 227 and it's readily available. If the leads are Gold plated you might consider pre-tinning them. If you need a higher temp alloy any of the major solder companies can help - I suggets you start with Ind
Electronics Forum | Wed Jan 26 21:30:06 EST 2000 | Dave F
Tuan: Consider Sn 96.5/Ag 3.5 or Sn10/PB88/Ag02 also. As Glenn says, you had better get rid of that gold or you will never have a shiney connection. Not that a shiney connection means anything about the quality or reliability of your soldering. M
Electronics Forum | Wed Apr 12 17:44:16 EDT 2000 | Rick
Glenn and Paul have hit the nail right on the head. Continue working with your solder vendors. I know that many people have succeeded with what you are trying. And the Pb-Free push is only making things better for you as companies develop just wha
Electronics Forum | Wed Jan 26 21:16:28 EST 2000 | Dave F
Mark: It sound like one or more of the following is happening: * Previous heat cycles (ie, reflow, reflow, wave) are degrading the surface protectant * Wire solder flux doesn't have enough stomp to burn through the corrosion. That poor ol' stuff
Electronics Forum | Tue Jan 25 20:19:24 EST 2000 | Charley Qin
Hi, Mark Acturally, solder paste viscosity reading is very closely related to eviroment such as temperature and relative humidity. So I'm afraid it is hard to tell the diffrence between measurements without enviroment control. Regarding to LSM, we'v
Electronics Forum | Tue Jan 04 07:22:12 EST 2000 | Michael Selva
One of the boards has a via designed right in the middle of a pad for a 1206 cap, one side only. This causes the solder paste to run into the via during reflow. We run No-Clean paste. One alternative is to increase the aperture on the stencil for tha