Electronics Forum | Tue Oct 22 13:11:07 EDT 2002 | slthomas
After considerable hemming and hawing, we decided to drop the bomb on 'em....give us ORL0 (which we use here) AND no bottom side solder balls or belly up to the bar with some favorable Appendix B test results on their preferred flux. As usual, Mr. F
Electronics Forum | Tue Nov 05 09:21:18 EST 2002 | stefwitt
After all, you may want to consider a Flip Chip process. The chips are bumped with tiny solder balls while still on the wafer. You may present the bumped chips in Gel Pack, trays or Surftape to your Pick $ Place machine ( if capable for Flip Chip pl
Electronics Forum | Sun Nov 10 22:31:53 EST 2002 | caldon
Staking and Conformal Coating Training Program is provided by Soldering technology. http://www.solderingtech.com contact Mel Parrish or Dan Foster at : Soldering Technology International, Inc 102 Tribble Drive Madison, AL 35758 Telephone: (256) 461-9
Electronics Forum | Thu Nov 07 07:35:23 EST 2002 | cyber_wolf
If you are experiencing flux migration, try refrigerating your paste when not in use. This causes the flux viscosity to go up. I have seen flux seperate from the solder is when it is VERY old and out of date.Sometimes warmer ambient temperatures wi
Electronics Forum | Wed Nov 06 16:05:03 EST 2002 | cvrgirl
Hi Victor, I made many micro-sections for analysis, and I have seen porous, dense, and grainy solder joints. The condition has to do with the constituents within the solder and its reflow temperature. I can search your subject on IEEE and email you
Electronics Forum | Thu Nov 07 12:07:46 EST 2002 | slthomas
This is more of a two-dimensional phenomenon than the linear features (wrinkles) that I would associate with disturbed solder. What I should do is contact my own solder supplier on this, I guess, but it hasn't been particularly high on my priority l
Electronics Forum | Thu Nov 07 12:35:38 EST 2002 | slthomas
Sounds like you're talking about the "heel" of the lead not being soldered, in other words, no heel fillet, which IS necessary. That problem, for us, was attributed primarily to poor layout (insufficient length of pad extension to provide room for
Electronics Forum | Sat Nov 09 15:13:06 EST 2002 | mjabure
If I understand what you're saying, you are reaching reflow temp's on the top side while soldering bottom side components. You might want to run a glass gauge plate over the wave and make sure your contact pattern isn't too large. If your PCB is in c
Electronics Forum | Tue Nov 19 15:08:45 EST 2002 | steve
Be careful, if you are using a water soluble chemistry then your pre-forms that are impregnated with flux may dry out prior to use. If your using a no-clean application then ther should be no worries. Aim solder out of Rhode Island is very good with
Electronics Forum | Mon Nov 25 18:16:40 EST 2002 | Dreamsniper
What really happens during the oxidisation process during reflow soldering? Where does the oxide goes...mix with flux etc...Is there a tin-oxide and lead oxide during the process? I believe that during wave soldering the oxides become dross...but wha
