Electronics Forum: soldered (Page 871 of 2099)

Nitrogen wave soldering

Electronics Forum | Sat Feb 15 15:39:53 EST 2003 | Joe

I have the identical machine and setup as you with the same issue(s). I looked at setting up for N2 but am choosing to retrofit to a standard lambda nozzle setup. If you are soldering bottom side SMT parts or other challenging assemblies, N2 may ma

Epoxied Parts Falling Off

Electronics Forum | Mon Feb 24 10:21:29 EST 2003 | ryanm

Just an update on my problem. I spoke to Loctite and they had very few solutions. One thing they suggested to try was to add a thirty-second soak time at 150 degrees to my reflow profile. The problem with that is ramp-soak-spike profiles doesn�t s

PCB Baking

Electronics Forum | Fri Feb 28 08:57:34 EST 2003 | davef

We used to bake [100*C for 6 hours] all of our boards, but no longer bake at all. Before going off, your bake recipe is probaly OK. If anything, it's probably too short. Consider measuring the weight of wet boards, baking for a time, measure, bake

SMT

Electronics Forum | Wed Mar 05 05:29:49 EST 2003 | Matherat

Our company does not assemble boards but our customers do and 2 side smd with through hole is pretty common in our experiences.Our customers usually have already decided to glue the bottom side components and fuse them during the wave solder process.

TSOP40 Lead pitch 0.50mm recommended aperture sizes?

Electronics Forum | Sat Mar 08 11:04:47 EST 2003 | Joe

Mark, You've already received some good advice from the other posters. The one thing I would add is that even if you solve your printing issues on this type of part, the relative small quantity of paste may be prone to soldering problems. Ever s

Solder paste change

Electronics Forum | Mon Mar 31 11:10:43 EST 2003 | davef

First, most �thermal shock� recipes are not a reliability test. There is no relationship between the failures seem in these tests and in-use application. These tests show you the failures in these tests. That�s it!!! Second, accelerated life test

16 mil pitch QFPs / solder paste type 4 & 5?

Electronics Forum | Mon Apr 07 09:52:07 EDT 2003 | kmorris

I have just started an assembly which uses a 16 mil pitch QFP. We ran on Saturday, using a type 3 solder paste. (working Sat's really sucks) We really struggled with paste release after the stencil sat for 15 minutes without printing. Apertures clog

PCB layout with BGA

Electronics Forum | Fri Apr 11 09:36:55 EDT 2003 | davef

We don't know anything about using "old Tango for DOS". First, consider the fabricator of your part as the THE most appropriate place to look for layout recommendations. We've discussed the heirarchy of sources for layout information previously he

Use and Restrictions of solder containing lead

Electronics Forum | Tue Jun 03 12:24:50 EDT 2003 | blnorman

I have received information from the European Commissioners Environmental group that automotive electronics are not covered by WEEE (waste electrical and electronic equipment 2002/96/EC) or RoHS (reduction of hazardous substances 2002/95/EC) because

Lead Free soldering profile for SMT

Electronics Forum | Sun Jun 08 19:30:25 EDT 2003 | MA/NY DDave

Hi Gee I got computer crashed at my last try. I am glad to see my note got through pointing you to the other contributors. One thought about that profile they give is that they JEITA or Jedec or ??? with a J is striving to balance what they know


soldered searches for Companies, Equipment, Machines, Suppliers & Information

Equipment Auction - Eagle Comtronics: Low-Use Electronic Assembly & Machining Facility 2019 Europlacer iineo + Placement Machine  Test & Inspection: Agilent | Tektronix | Mantis Machine Shop: Haas VF3 | Haas SL-20 | Mult. Lathes

World's Best Reflow Oven Customizable for Unique Applications
pressure curing ovens

Benchtop Fluid Dispenser