Electronics Forum | Wed Aug 29 16:33:45 EDT 2001 | Mike Konrad
Kerry, Why don't you purchase a decent stencil cleaning system that will not leave behind dry solder paste rather than purchasing a machine to tell you how dirty your stencils are? For less than the cost of a stencil inspection station, one can pur
Electronics Forum | Tue Sep 04 18:11:18 EDT 2001 | davef
Assuming you're asking about double sided reflow soldering ... Use pad mating to lead wetting area. Bob Willis has found the ratio to be as much as 44 grams/sq in. Check Bob's site [Electronic Presentation Sevices] for more. Phil Zarro uses the
Electronics Forum | Wed Sep 05 14:53:45 EDT 2001 | Jeff Meier
We have customers that are requiring no flux residue left on boards after soldering of non-water washable parts. We currently use Multicore Crystal 502 No-Clean to solder parts that are not washable. Has anyone come up with a good way to remove this
Electronics Forum | Thu Sep 06 09:49:26 EDT 2001 | ksfacinelli
This is a real problem. We have experimented with a number of off the shelf products as well as discussed the issue with a few solder manufacturers. As you are aware IPA or Flux off can make the product look worse. I would discuss with the custome
Electronics Forum | Tue Sep 18 10:22:22 EDT 2001 | jschake
Paste Flux / Reflow: Our experiments indicated that the combination of no-clean solder paste and air forced convection reflow produced the fewest tombstone defects, followed by water-soluble paste reflowed in air, and most tombstones occurring with
Electronics Forum | Tue Sep 18 01:41:23 EDT 2001 | shvetangcd
Hi Jeff, We are having solder-short problems for BGA, QFP, and some other fine pitch parts while using DEK screen printers. The PCB is processed on the second half of the line for screening the side with BGA, QFP, and other fine pitch parts. Which m
Electronics Forum | Tue Sep 25 12:49:58 EDT 2001 | Hussman
Been there - done that. Makes a mess on that 2nd reflow process- doesn't it!?!?!? This is caused by design. If the open via is located in the land area, it will flow thru the via and cause pumps on the opposite side. You can have your vias filled
Electronics Forum | Thu Oct 25 21:04:18 EDT 2001 | davef
You are correct. So, the unit amount of gold [based on IG plating thickness, size of the pad, etc.] dissolves in the solder very quickly. When the solder is liquid for: * A long time, the gold disperses more. * A short time, the gold concentrates a
Electronics Forum | Thu Oct 25 04:52:17 EDT 2001 | Vai
I'm running intrusive reflow. What happened was when the board went thru' the first reflow ( which is secondary side ), at Post reflow, I can see the solder joint quality is very good smooth and shiny. But when we proceed with the 2nd reflow, at Post
Electronics Forum | Mon Oct 29 16:34:02 EST 2001 | patcope1
I have a custom connector that tends to lift during reflow. The PCB retention tabs and pins are lifting off of the pads on the board and the solder is forming underneath the pads, with no heel or toe filet. Is there anyone out there that can help if
