Electronics Forum | Wed Jul 12 21:47:41 EDT 2000 | Dave F
Celiav: Mark is probably spot-on on his comments about a board fab problem. It is weird that you have similar problems from two suppliers though. Recommendations are: � Get rid of any bird brain contractor that installs processes that affect your
Electronics Forum | Wed Jul 12 21:39:46 EDT 2000 | Dave F
George: Interesting. I've found a couple of sources for antistatic Acetal. OK. To the point: I don't know, but I plan to talk to slective wave solder fixture fabricators. Several are listed in the archives Good luck
Electronics Forum | Mon Jul 10 09:28:20 EDT 2000 | George English
I am looking to purchase an inexpensive gerber editing package. Does anyone have any ideas. It will be primarily used for the design of solder paste and adhesive stencils.
Electronics Forum | Thu Jun 29 13:18:23 EDT 2000 | Gary
I was reading SMTs report on Lead Free solders and saw repeated references to Fillet Lifting as a failure mode. I have not found an explanation of what this is. Can anyone enlighten me? Thanks
Electronics Forum | Wed Jun 28 12:29:59 EDT 2000 | Christopher Lampron
Does anyone know what the min-max plating thickness for HASL is? Is there a specification that defines this requirement? We have had problems with PCB's that have excessive solder plating on the pads. This wreaks havok with our QFP's. Any help would
Electronics Forum | Wed Jun 28 12:29:56 EDT 2000 | Christopher Lampron
Does anyone know what the min-max plating thickness for HASL is? Is there a specification that defines this requirement? We have had problems with PCB's that have excessive solder plating on the pads. This wreaks havok with our QFP's. Any help would
Electronics Forum | Tue Jun 27 11:39:16 EDT 2000 | Chris May
Leon, Have you tried a piece of glass, deposit some flux onto glass, place the BGA in the glass to flux it, replace BGA and reflow using existing solder deposition ?? Regards, Chris
Electronics Forum | Tue Jun 27 09:12:15 EDT 2000 | james liang
hello all, DSS Model of cordless phone base unit during process TOP - REFLOW- FCT - BOTTOM - REFLOW - Wave solder and then the IC101 leg of RF unit lifted..?
Electronics Forum | Wed Jul 26 09:14:47 EDT 2000 | Peter J. Lensch
Hi DT, there is a pallet type system available from ERSA. Please contact ERSA Inc in Wisconsin, Bob Klenke, phone number 262 375 6844. PJLensch ERSA GmbH in Wertheim
Electronics Forum | Fri Jun 23 09:54:20 EDT 2000 | Dave F
Igmar: Chrys and JAX make good points. I'd like to add that you should be careful that you don't starve larger chip components of solder when using a 4 thou stencil.