Electronics Forum | Wed Jun 23 13:59:35 EDT 1999 | Cunli
Dave, It could be more than the size of the article. We are looking into it. We have emailed the contributor of "Lead Free Solder ... ", who is a frequent visitor to the site. Hopefully we will hear from him and know what went wrong soon. Thanks
Electronics Forum | Mon Jun 21 15:46:00 EDT 1999 | Chrys Shea
I swear I posted it! I smoked an entire cigarette waiting for the damn thing to upload! I'll try it again when I get home tonight. Sorry for the inconvenience.
Electronics Forum | Mon Jun 21 21:14:16 EDT 1999 | Dave F
| I swear I posted it! I smoked an entire cigarette waiting for the damn thing to upload! I'll try it again when I get home tonight. | | Sorry for the inconvenience. | | | regular or filter?
Electronics Forum | Fri Jun 18 15:56:33 EDT 1999 | C.K.
Has there anyone bold enough to try this in their shops? My cubemate just got through telling me that at his last shop, they had bare copper boards (no HASL, no OSP, no nothing), with minimal solderability problems.
Electronics Forum | Fri Jun 18 20:09:52 EDT 1999 | Dean
| Has there anyone bold enough to try this in their shops? My cubemate just got through telling me that at his last shop, they had bare copper boards (no HASL, no OSP, no nothing), with minimal solderability problems. | yes, 8 years ago I developed
Electronics Forum | Mon Jun 14 13:51:11 EDT 1999 | Chrys Shea
| | Dear All, | | | | We are having a big debate over what is the industry standard in DPPM on the wave sodlering process. is a DPPM of about 800 satisfactory. As per our big bosses it should not be more than 50 DPPM. Is the figure realistic. We
Electronics Forum | Tue Jun 15 04:55:00 EDT 1999 | Brian Ellis
The other answers on this thread are realistic but it also depends: a) on the quality and finish of the components and PCB (including, of course, solderability) b) the flux type (I would expect lower defect rates with water-soluble than with the less
Electronics Forum | Sun Jun 06 08:00:06 EDT 1999 | Dave F
snip | Ryan, | | The only advive I got is just don't do it!. Dave's right the grain growth in it is pretty bad. the other thing you got to look at is how much heat is the board gonna produce in it's working life..??? and where is it gonna be used,
Electronics Forum | Tue May 25 07:03:34 EDT 1999 | Milan Z.
After reflow proces in convection-IR oven we find broken body of SOT23 elements. There is no problems on other elements (SOIC, chip R,chip C, etc) Where is the problem? Thanks in advance!
Electronics Forum | Wed Jun 30 18:02:53 EDT 1999 | Mark
| What is the best way to re-ball a BGA? Who has the best system for doing it? | To RE-Ball an IC you must re-BALL the IC! The idea of using a stencil to deposit all of the appropriate solder mass can not work. Here is the process (minus the app
