Electronics Forum | Thu Oct 22 16:09:09 EDT 1998 | jvo
Does anyone know of a German company by the name of Wolf, I was told they make selective soldering machines, which by the way, is something I'm looking into.
Electronics Forum | Wed Oct 14 16:58:30 EDT 1998 | Earl Moon
| It seems like most people want to X-Ray their BGAs. We're going to start doing a lot more of them and need to consider X-ray, too. | Q: Do most people/companies X-ray everyBGA or do they just do SPC? | Q: Can you get away with spending 25K? 30K? H
Electronics Forum | Tue Oct 13 18:28:51 EDT 1998 | Graham Naisbitt
Upinder, Using IPA does not cause the residue, it simply exposes it. Given that all fluxes leave reisdues, it follows that these MUST be benign - but how do you know, and how do you control it. You are using flux to remove oxides and give you a go
Electronics Forum | Tue Oct 06 16:50:51 EDT 1998 | Manish
Hello Everybody Would anyone of you know about the impurities in the Ni/Au pad metallurgy (board side metallurgy) affecting the assembly of the chip on the board. I was told that impurities in gold may lead to void formation in the solder bumps.
Electronics Forum | Thu Oct 08 12:11:34 EDT 1998 | Rick Wyman
| Does anyone know of an AOI system that can look at the solder joints of SMT chip devices (1206,0805 & 0603) and make a reliable presence/abscence call of the joint on a HASL PCB. A low false call rate (much less than 1%)is required. Any info. fro
Electronics Forum | Fri Oct 02 09:52:49 EDT 1998 | Ben Wilmot
I am experiencing solder paste comtaminatin of nozzels on 0603 size components resulting in missing components. The machine is failing to alarm under these circumstances. Has anybody else experienced this problem & found a solution?
Electronics Forum | Wed Oct 07 15:44:43 EDT 1998 | CW
There's a good article on lead-free assembly of mixed technology in the May issue of SMT Magazine (pg. 52)
Electronics Forum | Mon Sep 28 12:55:37 EDT 1998 | Manish Ranjan
Hi Everyone Does anyone has any insight regarding the void formation in the solderbumps during wafer bumping by electroplating. Someone told me that it could be mainly coz of the alloy concentration being incorrect. Any suggestions, corrective action
Electronics Forum | Sat Sep 26 22:08:07 EDT 1998 | Jeff Sanchez
I recieved a pack of sensitive IC's that said they needed to be baked befor certain processes. If I need to do rework, do I have to bake prior to single soldering of these IC's. Or can I just place one as needed by hand with out baking? Any info woul
Electronics Forum | Mon Sep 21 21:57:17 EDT 1998 | Yuen
How can I solve the small solder ball in the N2 W/S ? The Oxygen level is 10000~20000ppm & no-clean flux.
