Electronics Forum | Thu Aug 21 14:23:56 EDT 2003 | kenBliss
In order to service your wave solder machine safely, the following needs to be understood. Ladling dross out of the machine and putting it in into a coffee can or similar is not safe and puts operators and other employees at risk. Protecting the se
Electronics Forum | Tue Apr 13 17:48:54 EDT 2004 | davef
Q1: Can anyone explain to me about the effect of their mixture. A1: What is their �mixture�? Q2: What enhancement does my BGA will have when using a WS paste flux with regards to corrosion, 25 years life cycle of the solder joint. A2: Tough to say
Electronics Forum | Mon Jun 28 10:03:22 EDT 2004 | davef
First, welcome to your new job. Second, IPC-TM-650 2.6.14 is only loosely an �Ionic Contamination (Electromigration) Test�. * Electromigration Test, IPC TM 650 2.6.14, 2.6.14.1 * Ion Chromatography for Ionic Cleanliness, IPC TM 650 2.3.28 Third, I
Electronics Forum | Wed Aug 11 18:36:03 EDT 2004 | davef
90 Knoop. Q2: Thickness is 4 to 10 u" for Au and 300 to 400 u" for nickel A2: This looks like a ENIG spec. Although, the Ni is quite heavy, 150 uin is sufficient for most applications. [IPC-4552 ENIG specification: * Gold thickness of 0.075 - 0.125
Electronics Forum | Thu May 26 16:41:00 EDT 2011 | scottp
Here's what I do: - Test Surface Insulation Resistance (we're in the high reliability market and use a test significantly harder than IPC's). I also test SIR in combination with other assembly materials like conformal coatings and wave solder flux
Electronics Forum | Tue Oct 12 05:09:13 EDT 1999 | Brian
| | | | | | | Can anyone tell me the formula/method to determine | | | | | | | the amount of weight that solder's surface tension can support. | | | | | | | (ie: Maximum weight of components soldered onto a bottom side | | | | | | | of a board during
Electronics Forum | Tue May 18 16:48:49 EDT 1999 | Tony
| | | | | What is the best way to re-ball a BGA? Who has the best system for doing it? | | | | | | | | | I'm using our SRT rework stuff to reball in house - when necessary. Of course, we only do this for protos and test boards. We use a standard mi
Electronics Forum | Sun Apr 25 12:05:50 EDT 1999 | Chrys Shea
| | | Has anyone had trouble waving and gluing 0603 R's and C's? At my company, our designers have "opened the floodgates" on bottom-side 0603's. | | | | | | We've got an EPK+ with rotary chip and omega wave but can't seem to get skip-free solderin
Electronics Forum | Mon Apr 26 09:18:27 EDT 1999 | C.K.
| | | | Has anyone had trouble waving and gluing 0603 R's and C's? At my company, our designers have "opened the floodgates" on bottom-side 0603's. | | | | | | | | We've got an EPK+ with rotary chip and omega wave but can't seem to get skip-free so
Electronics Forum | Wed Feb 02 20:53:34 EST 2000 | Dave F
Dennis: Several points: 1 If you're talking AlphaLevel process (?): � Good solderability, as HASL, even no-cleans bite well. � Planarity, uniform deposit, no bridgin� of FP. � Doesn't store as well as NiAu ... LT 6 months sealed � Very sensitive t
