Electronics Forum: solderers (Page 1346 of 2099)

Re: BGA Xray inspection

Electronics Forum | Thu Apr 27 21:04:33 EDT 2000 | Dave F

Ron: Good news: Nicolet makes excellent machines. Bad news: I�m unaware of a machine with the capabilities you seek. * X-ray machines lack of resolution needed in relation to the crack geometries encountered within a high density single material.

Re: Open v.s viscosity

Electronics Forum | Thu Apr 20 21:45:10 EDT 2000 | Dave F

Wister: Oooo, I understand now what you mean by "an open." Sorry, I was (am) a bit dense. Your hypothesis is reasonable. On the other hand, have you looked at the traditional causes of tomb stoning also? For a defect to be a "tomb stone," it doe

Convection Oven and thermo profiling of Circuit Boards

Electronics Forum | Mon Apr 17 19:42:34 EDT 2000 | Russ Cutler

We just bought a new Heller 1800 EXL reflow oven for reflowing SMT boards. We us a low temp RMA solder paste with 2% silver. Everything we build is to IPC Class 3 specifications. We have approximately 600 different types of circuit boards we build

Solder Skips

Electronics Forum | Fri Mar 17 16:39:33 EST 2000 | Larry

We have just installed an omega wave to our W/S machine and are tring to W/S some of our bottom side surface mount components. I am still getting skips on some sot 23's. The component lay out meets all IPC 782 guidelines. I have verified these setti

HAL vs. Silver Coated

Electronics Forum | Fri Mar 10 08:42:40 EST 2000 | John

We're quoting out a new board design, and one of the prospective suppliers is pitching a silver coating process over hot air leveling. We haven't had experience with boards of this type, and I am concerned about any processing issues that may come u

Solderability on Immersion Gold

Electronics Forum | Tue Feb 29 13:18:16 EST 2000 | Steve Schrader

We have what appears to be a recurring problem. On immersion gold boards only, we are having solderability problems. After reflow, selected parts can be popped right off the board. There is then a dark haze left on the pad. The paste on the compon

Reflow Power Failure

Electronics Forum | Mon Feb 28 03:46:34 EST 2000 | Hany

Hello 1-In our facility we face a lot of power failures due to the to the city electricity network problems.So, it has hppend many times to loose some PCA's inside the reflow oven. Of course it costs a big money to buy a UPS for a reflow oven. One

Re: Paste Dispensing

Electronics Forum | Wed Feb 23 11:02:41 EST 2000 | John

John, I'll try to take a crack at it. We manufacture our own boards, and have a high mix. We currently have BOTH a Camalot 2800 Dispenser and a DEK 260 Screen printer. We use the camalot for glue applications, and prototype paste. We use the printe

your , please

Electronics Forum | Thu Feb 17 11:38:53 EST 2000 | Steve Thomas

We appear to have solved a major reflow process problem (poor quality joints on a 20 mil QFP100...excessive solder left on the lead leg, not much left for a joint) with a design change to the board. We gave ourselves considerably more room for a hee

Humidity of SMT component storage environment.

Electronics Forum | Tue Jan 16 18:00:50 EST 2001 | mikestringer

Hi everyone I am in the process of reviewing our storage of SMT components. At the moment they are pretty much on open shelves in the factory environment. We endevour to reseal components labled 'moisture sensitive' in their original packaging, bu


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