Electronics Forum | Thu Dec 31 01:09:18 EST 1998 | Kelvin Chow
Dear Micheal, SIR test is used to characterize fluxes by determining the degration of electrical insulation resistance of rigid printed wiring board specimens after exposure to the specified flux. (IPC TM-650 #2.6.3.3 http://www.ipc.org/html/tm2.6.h
Electronics Forum | Thu Dec 31 14:20:35 EST 1998 | Michael Allen
Kelvin, Yes, we're referencing the same spec. I performed the test under the Class 2 conditions (except that I used a 100V bias rather than 50V...but my water-washed microBGAs still passed). Regarding the omegameter test: we have this instrument,
Electronics Forum | Mon Dec 28 19:28:57 EST 1998 | Chad Haima
| We have a new PTH board that utilizes lap pads on the B/S. Some of the pads are paired closely together and are aligned at angles (30,45,60 degrees)to the boards direction of travel through the wave. The pads most always bridge together. I realize
Electronics Forum | Thu Dec 17 17:34:26 EST 1998 | Earl Moon
| Has any anyone established / published quality standards for BGA solder joints? Is IPC-A-610 in process of adding standards for BGAs? | The debate continues. I have felt for some time a maximum 20% voiding is allowable under certain conditions (w
Electronics Forum | Tue Dec 15 15:21:24 EST 1998 | Chrys
| SMTneters, | I'm famialiar with lambda, omega, and gemini waves but not with "A" wave. Can somebody give me an explanation? | | thanks | | Tom B. | Tom, The term "A" wave refers to an asymetrical wave. It's an Electrovert term that describes
Electronics Forum | Mon Dec 07 17:56:45 EST 1998 | Tom Braswell
I have been put incharge of developing a process to rework a doublesided SMT PCB with DCA/COB (direct chip attach, chip on board ) components. The rework will consist of removing some 603-1206 chips on both sides of PCB, oh yeah its has a polyuretha
Electronics Forum | Tue Nov 03 10:33:10 EST 1998 | Chrys
| We run stiffeners on all of our product through our wave solder process and most of our product through our reflow and adhesive cure oven. The problem is we continually put on and take off stiffeners because of poor reliability of stiffeners stayi
Electronics Forum | Wed Nov 04 16:56:27 EST 1998 | Chris Lampron
| | We run stiffeners on all of our product through our wave solder process and most of our product through our reflow and adhesive cure oven. The problem is we continually put on and take off stiffeners because of poor reliability of stiffeners sta
Electronics Forum | Mon Nov 02 09:44:21 EST 1998 | Michael Nguyen
Well my process is I'm running my belt speed at 3.50fpm and about 215 to 225 degrees top side. I got my main wave down to a little less than half the board thickness. I'm not using a hot air knife cause we thought it might create more of a problem th
Electronics Forum | Mon Oct 26 20:18:23 EST 1998 | Dave f
| I need some info on how to stop the bridges I'm having on | radial and axial parts that are in the same place on every board. I'm also having problems with sot-25 bridging. I'm using a Electrovert E-pak. I tried leveling the machine,solder pot, an
