Electronics Forum | Tue Oct 14 11:31:32 EDT 2003 | Ming Diaz
People, I have a hand soldering station made, according the label, by Analytic Technology. I think it is French manufacture. Can't find it on the net, I wonder if it's no longer made. If I can find another unit I'll buy it. Most of all I need rep
Electronics Forum | Mon Feb 16 06:38:37 EST 2004 | Chris Lampron
Hi Carl, We have several Mirtec MV2BTLs. We had done an extensive evaluation on tabletop systems only, as we did not have the available real estate to add an inline. We are using the system to verify value (when visible) orientation, presence/absent
Electronics Forum | Wed Jan 21 12:06:48 EST 2004 | Claude
What is the most effecient form of heating ,ie calrod, IR, convection , or a mixture ? to produce a good thermal profile on a wavesoldering system on thermally challenging multi-layered boards? Thanks, Adam Adam, I agree with Pete C. Forced co
Electronics Forum | Tue Jan 27 03:59:51 EST 2004 | KevC
Hi lads, Can anyone tell me a bit about PT500 application software? I recently had to replace the Hard drive in the host PC for our wave. I re-loaded the system software and re-configured. One thing I noticed however is in the "Calibrate T/C's" opti
Electronics Forum | Tue Feb 17 10:08:17 EST 2004 | russ
Do you have a bake oven that will reach 200C? You could bring a batch of boards up to temp and then start the pluckin'. A sfar as the solder goes if you apply flux to the leads they remove very clean as far as solder goes. To remove the flux we pl
Electronics Forum | Wed Mar 24 20:19:09 EST 2004 | Ken
I recently did a no clean flux eval and by far the leader in the category for remainder (residue) was Interflux 2005MZ 1. You first mission is to provide acceptable solder joints. 2. Only apply what you need to achieve acceptable results. Spray f
Electronics Forum | Wed Mar 31 20:34:03 EST 2004 | davef
We have not used this specific package. We agree on your toe fillet idea. Toe fillets add no strength to solder connections. This part is a MicroLeadFrame�, which is similar to QFN, BCC, LGA, and whatnot. Consider: * Searching the fine SMTnet Arch
Electronics Forum | Mon Apr 12 22:49:09 EDT 2004 | Ken
I will assume the balls of the device are tin-silver or tin-silver-copper??? There is no reason why you can not run 63-37 solder paste on this device. You will form an intermetallic at the interface structure, however, you will NOT form the 2/3 col
Electronics Forum | Mon Apr 12 15:52:12 EDT 2004 | wgaffubar
I am using Indium 92J type 4 solder paste due to a BGA site with .008" pads and stencil opening of .009" square and .005" stencil thickness. When I try the type 3 we get insuffecient print. The aspect ratio tells me that I should be using a type 4. T
Electronics Forum | Wed Apr 14 05:44:36 EDT 2004 | hun
Hi All, Just have a share with you guy. We are using T4 solder paste and also E-Stencil. We ahd try out Alpha, Kester, AIM and Qualitek. The result show Alpha had a very very heavy stack flux and can't get it clean off even by chemical
