Electronics Forum | Tue Jul 19 15:04:10 EDT 2011 | ccouture
Seika make a solder paste recycling unit that will melt solder paste and separate the solder from the flux. You end-up with liquid flux in a jar and a block of solid solder, which you could re-use in a solder wave if the type is the same.
Electronics Forum | Sat Sep 03 13:01:36 EDT 2011 | waveroom
I'm thinking that your soldering irons are not up to the task. take a tip temperature measurement of the iron prior to and during soldering process. With high temp solder alloys you need an iron that provides continuous temperature at the tip. Doing
Electronics Forum | Thu Mar 29 08:28:28 EDT 2012 | williamaxler
In the IPC-A-610E standard QFNs are classified as BTC (bottom termination components). Most QFNs do not have a solder-able surface on the outside of the part. Usually the lead that you can see on the outside is copper and classified is not solder-a
Electronics Forum | Thu Dec 12 12:54:25 EST 2013 | jaimebc
For selective soldered components, or even hand soldered, with vertical bend components, the body of the component, in this case a resistor, is making contact with the surface of the PCB, making it impossibe to visually see the solder fillet. Or to d
Electronics Forum | Wed May 11 09:07:46 EDT 2016 | SN
We are facing SMT components No solder and solder bridging issue (Glue PCBA) at wave soldering process. Fine tuned the wave parameters improved but not able to eliminate the issue. Suspecting because of moisture pad and component leads contaminated d
Electronics Forum | Tue Jul 19 08:26:46 EDT 2016 | pavel_murtishev
Aleksander, The answer is no. Solder deposit being printed is 80um-150um in height depending on PCB design what is two times higher than any track covered by solder mask. Molten solder will merely center the component. QFNs are prone to soldering
Electronics Forum | Wed Mar 01 01:45:58 EST 2017 | soldertraining
Learning to solder through-hole components is an essential skill for any electronic professional.And basic soldering is easy to learn if you are building simple electronic circuits. Also the most common solder alloy used in electronics is 60% tin an
Electronics Forum | Tue Jun 20 15:08:30 EDT 2017 | ranap121212
Hello I have the problem with selective soldering on the robot. Thin balls appear on the laminate. The tin sometimes shoots...? and then the balls are a few millimeters from the soldering point. I tried up or down with temperature, but it did not wor
Electronics Forum | Thu May 03 12:59:55 EDT 2018 | donnie15
Our customer is asking for a solder ball dispersion test on our string solder for rework. The do not provide a test spec, only the attached diagram? has anyone seen this before? It looks like just pushing the solder against the iron and counting th
Electronics Forum | Mon Nov 26 09:33:49 EST 2018 | charliedci
The problem you create by soldering from solder destination side (presuming you have already soldered from other side) is that you will trap air in PTH so you have virtually no continuous solder in PTH from one side to other. This will not meet IPC-A
