Electronics Forum | Tue Dec 12 01:52:05 EST 2006 | hemu_me
As we have vitronics oven(SMR610A) made in dec,1997,which has 5 heating zones and 2 cooling zones. For Lead free soldering what should be our baseline for low/medium boards.we have gathered profiles from various paste manufacturers,however we don't k
Electronics Forum | Fri Dec 15 09:44:38 EST 2006 | mashmo
Hello I am a circuit board designer and just wanted to ask if anyone is seeing the need to alter footprints for ROHS assembly. I also wanted to make sure that I have this particular issue correct. If your BGA is lead free then used solder paste with
Electronics Forum | Mon Dec 18 14:36:09 EST 2006 | samir
Yikes!! In-line cleaning, to clean cosmetic and benign residues (from a NO-CLEAN) flux... You sure you can't switch fluxes? Another variable with residues is the solder mask. Depending on mask type (glossy, matte, semi-gloss, or semi-matte), will
Electronics Forum | Mon Dec 18 23:24:50 EST 2006 | grantp
Hi, Yes, I would hate to resort to cleaning, but the product must be clean. We have been using palettes to keep most of the flux off the PCB, but there is still residue around the connectors. Does anyone suggest a good no clean flux to use with le
Electronics Forum | Wed Dec 20 16:30:40 EST 2006 | CK the Flip
I've seen smaller components have a "charred" appearance and a lack of wetting up the component termination. Also, extended heat exposure may introduce excessive IMC (intermetallic) formation - the bad kind, that is. That's where your IMC layer wil
Electronics Forum | Wed Jan 10 17:11:53 EST 2007 | mscalzo3
I always try to profile using a fully populated board and soldering the thermocouples. This is the only true way of getting an actual temperature of the joints. But, with that being said, its not always feasible to use this. There have been a coup
Electronics Forum | Fri Jan 12 07:00:27 EST 2007 | GDO
Hi guys, Pin in Paste guidelines will be included in the IPC-7525A "Stencil Design Guidelines". This draft is being reviewed now and is scheduled to be released by February, (March at the latest). There are many other sources for these guidelines
Electronics Forum | Wed Feb 21 21:01:57 EST 2007 | davef
Yes. Heat reduces OSP solderability protection thickness. For instance, many OSP are shot at the end of the first reflow pass and the exposed copper is free to oxidize. If you're speedy, you can pull-off the second reflow cycle before the copper g
Electronics Forum | Wed Jan 03 23:00:18 EST 2007 | new guy
I'm a new guy in this field. I have a question about solder paste process. Is there any effect to the solderbility if we do a lot of contact to copper pad without using any insulation ( direct to the finger ). Where can i get information about smt pr
Electronics Forum | Mon Jan 08 17:32:47 EST 2007 | Board House
Hi Oswald, Shelf life with ENIG if vacuum sealed and kept in controled enviroment would be 12 to 14 months. Shelf life in shrink wrap - No recomended packaging, 6 moths. If Shelf life goes over the 12 -14 months - Baking ? I would not suggest re-b
