Electronics Forum | Sat Jun 16 07:48:09 EDT 2007 | grantp
Hi, We are using emerson gold, and I have not seen any evidence of black pad, as the pads are clean and gold colored when the part comes off. That is what worried me, as I would have thought that if the solder melted correctly, it would have stuck t
Electronics Forum | Fri Jun 22 09:56:24 EDT 2007 | crashoveride
uhm.... we're not doing this solderability test that often... it's more likely of a run-to-failure, lolz.. anyway, i think this should be quality department's problem since they do the production monitoring (In- line QC), Material sampling and gatin
Electronics Forum | Thu Jul 05 00:23:50 EDT 2007 | reypal
Im not sure if someone has posted this topic before. Anyway,we plan to make capability study on our wave-soldering machine but we have no experience on how to do it effectively. My question is what we should consider most among the critical parameter
Electronics Forum | Thu Jul 05 10:32:56 EDT 2007 | realchunks
WRONG! Actually I was going to say the same thing but figured I would have the standard 3 people dissagreeing with me, and or correcting me. I do believe your wave solder temp should remain a constant temp and prolly will not vary at all, so I woul
Electronics Forum | Thu Jul 05 13:47:10 EDT 2007 | arun2382
QFN assembled on a PCB indicates paramteric fails when tested. When the QFN on PCB is reflowed a second time, it recovers and passes testing. Visual, X-ray inspection revealed no anomalies. Cross-section images of solder joint revealed no anomalies (
Electronics Forum | Thu Jul 05 17:10:29 EDT 2007 | arun2382
Thanks all! I'm facing this issue with one specific batch of QFNs. It could be a plating issue. But, nothing was evident from visual inspection,No sign of voiding or non-wetting. Cross-section images of solder joints were clean as well. Could this s
Electronics Forum | Mon Jul 16 08:42:14 EDT 2007 | realchunks
Hi Scott, Here is another thought. Check your wave solder machine visually. Does the wave flow on both sides of the nozzle? If not, you may have some dross build-up which may be causing your problem. Generally it will only happen on the very fir
Electronics Forum | Fri Jul 13 12:20:33 EDT 2007 | jdumont
There are a lot of areas that could be leading to this problem. We have some of these issues on some boards with this solder as well but the hole fill still meets IPC class 3 requirement of 75% vertical hole fill. Through hole diameter is important.
Electronics Forum | Mon Jul 16 09:53:36 EDT 2007 | ed_faranda
Yes, you can use lead-free parts in a leaded process. And the other is true as well, no-lead free parts in a leaded process. BUT, you should not use leaded parts through a non-lead wave solder process and of course, your board will not be RoSH.
Electronics Forum | Tue Jul 24 08:41:16 EDT 2007 | babe7362000
Does anyone out there run the adhesive side first and then the solder side and wash? I was just wondering if this is a good practice or not. I am afraid that we will lose some of the parts, that are just glued on, in the washer? Basically I am try
