Electronics Forum | Wed Feb 08 07:52:21 EST 2006 | davef
'TAL' is a poor measure of solder connection heating. In a reflow process, what you need is about 5 seconds at liquidus for the specific solder plus: * 20*C when soldering to Cu. * 35*C when soldering to Ni. This time over temperature is measured
Electronics Forum | Wed May 03 11:12:08 EDT 2006 | samir
Iron huh? You sure about that? We have the ERSA Versaflows and our nozzles are made out of ST37 Tool Steel. There is an "American equivalent" to this grade but I forgot what it is. You'll have to google it like I did. Anywho, Tin or Tin-Lead sold
Electronics Forum | Mon Jun 19 08:45:55 EDT 2006 | dougs
Hi All, We have a board that's going through our process at the moment, it's 1.6mm thick and has 4 wires soldered into it, these are 10SWG multi stranded wires, i'm finding that it's difficult to get the holes filled with solder as it travels up
Electronics Forum | Tue Jun 20 21:30:05 EDT 2006 | davef
The minimum vertical hole fill is defined as follows: Class 1: Not specified, with a 270-degree circumferential fillet and wetting on the secondary (solder source side) of lead and barrel, and a 75% coverage of the land area on the secondary side. Cl
Electronics Forum | Tue Jul 11 20:13:05 EDT 2006 | davef
We agree with Chunks. You need to turn-up the heat [slow the conveyor] because you have significantly changed the melting point of the solder alloy by adding so much gold. Relative to ENIG you should expect: * Similarly smooth surface, possibly a l
Electronics Forum | Thu Oct 05 23:44:55 EDT 2006 | zoltans
Hi, Has anyone got first hand experience with the JT wave soldering machines, WS series? I use a low solid VOC free flux and it seems I have problems atomizing the flux properly and this generates soldering defects, leaving lumps and big solder bal
Electronics Forum | Sun Oct 08 23:37:37 EDT 2006 | zoltans
Hi, Has anyone got first hand experience with the JT wave soldering machines, WS series? I use a low solid VOC free flux and it seems I have problems atomizing the flux properly and this generates soldering defects, leaving lumps and big solder bal
Electronics Forum | Tue Oct 31 22:13:48 EST 2006 | davef
We never run raw solder paste through our board cleaner, because: * Flux floats on the water in the tank and contaminates everything, including the boards being 'cleaned'. [Prove this to yourself by observing the location of gray schmutz on the insid
Electronics Forum | Tue Nov 28 11:12:48 EST 2006 | billwestiet
The ONLY (unlikely) cause I could think of is if you are pushing the component into the solder, ending up with more solder on one side than the other. Why do you think it is the volume of solder that is causing this? By the way, there are "low tomb
Electronics Forum | Thu Nov 30 15:19:56 EST 2006 | CK the Flip
Mike, dude, I feel your pain. Hearing stories like this makes my blood boil! It's almost as ridiculous as a customer who told me to put more solder paste on a MELF component to overcome noise issues - he used more solder paste as antennas to overco
