Electronics Forum | Mon Aug 04 12:29:12 EDT 2008 | realchunks
If you are getting top side wetting, I doubt if this is a Delta-T problem. It also could be there is a lot of flux on the top side of the board stuck between the connector and the board. This is easily checked by fluxing and not running th eZ axi
Electronics Forum | Thu Aug 14 10:54:21 EDT 2008 | diesel_1t
Comments are: * Link you posted to your brush > actually connects to a general catalog page. * > Not sure what solders your friend was using, but > pastes leave different residues that affect > probing. Some are soft and gooey, others are hard >
Electronics Forum | Thu Aug 14 21:58:43 EDT 2008 | proy
NO WAY I had seen this 10 years ago, and got into a 'p' match with the PCB fabricator. We had failures after wave solder, the thermal ezpansion caused cracks in the 'knee' where the skinny little trace go's over into the barrel. even if not failin
Electronics Forum | Mon Aug 18 10:42:04 EDT 2008 | floydf
We are in the process of preparing for a new board that requires paste in hole processing. The hole is a .020" via, and our customer wants it filled with solder, but not bulging past flush. For printers,we use a DEK 249 with a squeegee, and a DEK 260
Electronics Forum | Mon Aug 18 14:17:08 EDT 2008 | patrickbruneel
Here's another good one �Problems Implementing The Restriction of Hazardous Substances� http://desicritics.org/2008/08/17/120825.php Unfortunately it might take another 2 years to gather enough data on how much damage lead-free has done to our ind
Electronics Forum | Thu Aug 21 14:38:32 EDT 2008 | Paul M.
I have had a similar problem as this. But, not on that particular type of component. Have your machine place the component, take the PCB over to a microscope and look at the part how it sit's on and in the paste on the pads. You might see that one
Electronics Forum | Wed Aug 27 08:46:14 EDT 2008 | vladig
Hi Sean, It's an old problem with no definitive cure for now. However, there are a couple of things to look for. First of all the location(s) of HoP. If it was due to the componetn warpage, then it would be most probably in the middle and it should
Electronics Forum | Wed Aug 27 08:06:43 EDT 2008 | davef
Thick, hard conformal coatings of acrylic, urethane and epoxy have a well documented history of causing solder joint cracks and breaking glass/ceramic and other brittle components. Dissimilar expansion and fairly high surface bond strengths of the ma
Electronics Forum | Thu Aug 28 18:48:49 EDT 2008 | markhoch
You're using a SAC305 chemistry? Double check your liquidus temp! Your profile shows a liquidus temp of 217 degrees C. SAC305 is not eutectic. (It doesn't transition from paste to liquid instantly). It goes thru a "pasty" stage. We use a temp of 221
Electronics Forum | Thu Aug 28 21:43:23 EDT 2008 | davef
Couple of points: * We'll tell ya, although it's tough to tell from these pix, but it does not look like dewetting. It looks like nonwetting. * We don't think you're getting this product hot enough. We don't know where you measured the profile you po
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