Electronics Forum | Mon Jul 01 20:45:38 EDT 2002 | davef
Solder mask thickness specifications by fabricators are: * Wet mask: 0.0002 ~ 0.0004� on trace * LPI mask: 0.0002 ~ 0.0008� on trace Liquids usually range between 10 to 13 um (0.00039 to 0.00051") when dried. Liquid resist processes I have seen are
Electronics Forum | Mon Nov 11 11:42:26 EST 2002 | MikeF
Like Mark, I'm guessing your problem is with SMT parts on the top side, the solder is re-melting and some of the parts are moving around during when the board is being wave soldered. When I had some training on thru hole wave soldering way back when
Electronics Forum | Tue Jul 15 18:44:20 EDT 2003 | davef
Sam says, �The only question remaining to me is that why the failure happened after 48 hours instead of immediate failure after soldering.� Let�s recap: * Had good-looking solder flow. * Passed the initial electrical test. * Failed the later electri
Electronics Forum | Tue Sep 30 21:00:41 EDT 2003 | davef
We're not clear on what you seek. So, as a starting point for our discussion, we wouldn't get agitated if we saw "routine" coplanarity of 4 thou. For instance: Maximum Lead Coplanarity [Altera] Package||Acronym||Lead material||Finish||Maximum Lead
Electronics Forum | Thu Dec 22 12:05:37 EST 2005 | Tony
Currently we are using a 2 step vapor soldering process to manufacture our std. lead soldered parts. The first step was done with a ls240 vapor fluid and the second was done with a ls200 fluid. Using a 221 deg C sn95/Ag5 solder for the first step a
Electronics Forum | Mon Mar 26 06:10:54 EDT 2007 | RH
Dennis: Have you considered Asahi as a solder ball source? Asahi Technologies has helped produce over 90 million Lead Free PWB assemblies worldwide and has extensive experience in Lead Free solder processes at Sony, Hitachi, and Thompson. Solutions
Electronics Forum | Wed Apr 04 03:07:16 EDT 2007 | pavel_murtishev
Good morning, Problem definition Poor soldering of thermistors with Ag/Pd termination Background Process: lead free reflow soldering Paste type: Multicore LF300, SAC305 Component type: 0805 chip thermistor, Ag/Pd termination PWB finish: immersion A
Electronics Forum | Fri May 01 08:15:36 EDT 2009 | davef
Scavenging Methods [Improve Solder Scavenging of Large Area-array Sites, SMT, Laurence Harvilchuck, process research engineer, Unovis Solutions, harvilch@unovis-solutions.com] Two common methods exist for scavenging residual solder on the site for s
Electronics Forum | Mon Apr 19 15:45:21 EDT 2010 | dwonch
Thanks to all for your input. We did have a third party do an analysis on boards from the first shop. They were shipped directly from the board shop to eliminate the possibility that we could contaminate them. The third party (Forsite) did find Sili
Electronics Forum | Wed Dec 22 07:20:21 EST 2010 | piter
HI I used both of solder leveling HASL and ENIG, HASL I can recommended for biger pitch is cheaper solder leveling than ENIG but problem with that solder leveling is during the reflow process HASL isn't flat and during reflow process component move
