Electronics Forum | Tue Feb 01 09:54:23 EST 2005 | jbrower
Hi Frank, we're still going to go with FR4 as our prefered material. Our board thickness is .062. We use an on shore and off shore vendor. Prototron I believe offers an immersion tin and excellence in china? offers an immersion tin finish. We fou
Electronics Forum | Mon Jan 24 04:26:32 EST 2005 | Hannu
Morning all, Has anybody done any pin in paste job with a dispenser? I read somewhere that the needle i.d. should be slightly larger than the hole diameter, but with holes of 1.4 mm I would have to work with a very large needle indeed. How does past
Electronics Forum | Mon Jan 24 18:04:46 EST 2005 | Dreamsniper
=130�C as per IPC-4104/21 What will happen if I expose the PWB Assembly with components to a temperature of between 135'C to 152'C, which is above Tg, for 1 hour? Will there be delamination or possible damage to my PWB? What about with the rests of
Electronics Forum | Tue Feb 01 15:54:53 EST 2005 | jbrower
Hi George, The simple answer is that if you're company only does business in the US, or South america or Antartica or any where else that you aren't frozen out due to RoHS and the WEEE directives, then going lead free may not make sense. Unless your
Electronics Forum | Wed Feb 09 15:23:14 EST 2005 | GS
Hello, few comments: - what is the criteria to decide if re-ball or not a PBGA? - any electrical test is performed toPBGAs before reball ? - what in case the reballing has been done on a electrical damaged PBGA? In that case the replacement of
Electronics Forum | Thu Feb 03 13:23:30 EST 2005 | caldon
Hi Steve- We have a Glenbrook system and are pretty pleased with it....as far a value vs. cost it works great. I did have an issue with a Soic with a ground plane in the center...yes SOIC!!! The Ground plane was a heat sync that had vias for thermal
Electronics Forum | Fri Feb 04 08:15:02 EST 2005 | aj
We are starting to look at doing some trials at the mo. I have attended a couple of seminars with one on Wave Soldering coming up soon.Loads of info. now have to make sense of it all. Just a couple of questions/advise on how other people have approa
Electronics Forum | Fri Feb 11 00:22:05 EST 2005 | Grant
Hi, That's what I am thinking, and we might have a dirty stencils and cannot see the problem. We are going to get a magnifier, and check it out. I did not think the stencil could bur, but I didn't want to shoot the guys down when they had an idea on
Electronics Forum | Thu Mar 31 06:09:19 EST 2005 | amstech
Yes, components do contribute to the non wets in fine pitch reflow. Oxidation is the main culprit. May ask where it is coming from. Can not say in particular. May be burn in test process or end of line baking, hot / cold testing and need to run DOE'
Electronics Forum | Wed Mar 02 06:19:03 EST 2005 | pjc
Go to http://www.ipc.org and look up IPC-7351 - Generic Requirements for Surface Mount Land Pattern and Design Standard The successor to the IPC-SM-782A is here! The document covers land pattern design for all types of passive and active components
