Electronics Forum | Fri Jan 04 09:01:35 EST 2008 | davef
Here's a link to the article that Loco references in the above post: http://www.smtnet.com/library/files/upload/DevelopingaReliable.pdf The table seems to be taking a simplistic approach. J-STD-020C, Table 4-2 lists nine catagories of MSL classific
Electronics Forum | Wed Jan 23 19:44:45 EST 2008 | hegemon
In addition to the pre-emptive steps mentioned above, in my experience there are certain BGA package designs that seem more prone to that corner bridging. I have seen some packages that will essentially "curl" down at one corner as the package begin
Electronics Forum | Fri Jan 18 09:44:15 EST 2008 | operator
I have searched through the topics here and none seem to address this specifically. I was wondering if anyone had any links/info directly showing how proper ventilation for fume extraction on a manufacturing floor should be handled. From my research
Electronics Forum | Thu Jan 31 15:13:20 EST 2008 | chef
You will need to develop your reflow profile which includes drilling a hole through the fab and into the ball for accurate temp measure. During profile/process development you will probably want 3D x-ray (consider contracting that out). Once in prod
Electronics Forum | Tue Nov 25 11:35:11 EST 2008 | wavemasterlarry
Listen, I conqure with with wAyne on this one as your board house is always gonna the first person y a blame if you haven't adjusted any process paarameters in a while and see board related issues that can be traced to the board house. I once though
Electronics Forum | Thu Feb 07 14:58:08 EST 2008 | operator
We don't have one of those cool air compressed syringes to dispense adhesive. We have to do it by hand. My question is does anyone have any suggestions on syringe size, needle size etc... for successful deposition of SMT adhesive? I know you can go s
Electronics Forum | Fri Feb 22 14:22:07 EST 2008 | stevek
Are you using nocleans, especially when you get to SMT? Years ago, I had OA wave flux get into vias that were plugged from the top under parts. It is really difficult to clean small, high aspect ratio vias. Cross sections showed that the copper in
Electronics Forum | Tue Feb 26 17:00:15 EST 2008 | slthomas
I haven't had the luxury of machine based pth assembly in quite a while, but when I did, given that the machines control which parts are inserted (and to a lesser degree where they are inserted) we decided not to perform inspection on that part of th
Electronics Forum | Fri Mar 14 11:25:02 EDT 2008 | hegemon
ol' hege has got to agree with Chunks and Dave. Seems every time there is a problem, the finger is first pointed at the process. For my $.02 it doesn't matter if your process is 100% bulletproof, procurement will screw it up by finding a vendor that
Electronics Forum | Wed Mar 12 13:59:54 EDT 2008 | carsan
I am looking for some feedback on the Seica Firefly Laser Soldering System. We saw a demo and were somewhat impressed but would like to hear from anyone that has any practical experience using one. Specifically, we noticed that you have to select t
