Electronics Forum | Tue Jan 23 14:09:11 EST 2007 | behrsam
We have been struggling to create an improved higher yield process for hermetically soldering a metalized Ge window to Kovar. Process utilizes flux with a Indium alloy solder preform. End use is for a dewar package. We are looking for a consultant
Electronics Forum | Thu Jan 25 12:18:40 EST 2007 | wagoner
There are several smd components in our factory that don't reliably wet to solder during reflow. Paste and placement are good, but the component won't wet reliably. All of the other components on the boards solder fine, but one of these components
Electronics Forum | Thu Feb 15 21:59:09 EST 2007 | vshan
Hi Jim Good Day yes we are using a pallet bottom support as well as top cover. The top cover are design such a way that the solder paste area is open. the type of solder is lead free type(Avantec-ecorel free) in one panel consists of 28 parts and e
Electronics Forum | Wed Feb 28 11:43:20 EST 2007 | realchunks
Marcin, Think outside the box. If you are glueing the SMT part down, why not have an aperture cut in your stencil (or recut a stencil) between the SMT part and thru-hole. Wave solder hates SMT glue. This will get rid of your solder short problem
Electronics Forum | Thu Mar 01 14:13:23 EST 2007 | Brandon
We have a bunch of used solder paste we need removed from our facility. Who provides this type of service for a fair reasonable fee? We are in Austin, Texas and use loctite solder paste. Our supplier is Hisco, but they only provide this service for A
Electronics Forum | Thu Mar 01 16:47:05 EST 2007 | ratsalad
The guys that take our dross (and pay us for it) take our barrels that contain scrapped solder paste as well. Also in the barrels are the nitrile gloves and disposable towels used in solder paste handling and cleaning. They pay us for the metal c
Electronics Forum | Mon Mar 12 13:57:50 EDT 2007 | davef
That your problem is not related to component solderability or wave process related makes us believe this has to do with bare board design. Look at how your designer did the thermal relief on the two pins that don't solder well. If you can't get a
Electronics Forum | Mon Mar 26 07:19:09 EDT 2007 | realchunks
Hi Amy, 183 degrees C if it's 63/37 paste. For wave solder, your guide should be your flux. Follow your flux mfgers suggested pre-heat. Most mfgers go by top side temps. Your wave solder pot temp is determined by your bar solder mfger. The
Electronics Forum | Mon Apr 02 01:24:52 EDT 2007 | Haris
Dear all, I want to know the difference between the CSP and the BGA (I think there is only in the mesh pin difference). Secondly, if their solder balls have same dia, LxBxH are also same with the the manufacturing of the pin coating chemical elemen
Electronics Forum | Sun Apr 15 23:35:14 EDT 2007 | Sam
few more questions: Is there any standard saying that the dull surface is accepted if solder Au plated leads? Understand that more than 3% Au in the solder connection leads to unacceptable embrittlement of the connection. How about any standard relat
