Electronics Forum: solderers (Page 256 of 2099)

SMT Lead Free Line

Electronics Forum | Wed Dec 11 14:38:25 EST 2019 | slthomas

The one thing I haven't seen mentioned yet is developing the the control systems for the process equipment and materials. You don't want to mix up your solder paste, bar, and wire, and you don't want to cross-contaminate by using equipment (solderi

Best practice to validate the old - more than 5 year old parts

Electronics Forum | Thu Dec 12 17:39:14 EST 2019 | davef

When I hear "pinholes" in solder connections, I think of two sources, depending on the situation, which can be either: + Entrapped air and process chemicals develop during reflow soldering to cause the pinholes in and around the intermetallic layer

SMD Gull Wing Switch Cracking

Electronics Forum | Wed Dec 18 16:21:54 EST 2019 | jrow

Hello! We are having field failures due to cracking of the solder on our SMD micro switch components. I have been reading the IPC standards, and the only thing that it states regarding the solder profile/amount for Gull Wing component is "wetted fill

Soldering Issue in Sensor component

Electronics Forum | Tue Dec 31 10:17:12 EST 2019 | emeto

Let's stay away from the PCB and process for a while. This component is pre-tinned. What kind of solder? How is the component stored? I bet you that you can put just flux on the board and solder this part - have you tried? I think we should understan

Flux turns BRIGHT yellow when in contact with Tin/ Lead

Electronics Forum | Wed Apr 01 07:18:29 EDT 2020 | proceng1

We are using Superior 515 flux to clean and tin selective solder nozzles. Yesterday the flux turned a bright yellow (like a highlighter) when heated after the flux being applied. This does not happen with our Lead Free solder, only the Lead alloy.

SOLDER SHORT DUE TO VOID IN BGA

Electronics Forum | Tue Jun 16 19:41:46 EDT 2020 | emeto

Voids form mainly two ways. 1. Contamination - due PCB pads/part leads oxidation, wetting on the pad is bad forming void(these are usually borders with SMT pad - peripheral) 2. Process formed. These are in the center of the solder joint - could n

Stencil design

Electronics Forum | Wed Jun 17 05:41:04 EDT 2020 | SMTA-Davandran

I have one product which only need print low temperature solder paste on OSP pad. This pad will used for hot bar process. Desired solder paste thickness is 0.10 mm to 0.15 mm. Is any one can advise right stencil thickness and aperture opening for it.

Help TQFP welding problem

Electronics Forum | Fri Apr 16 17:44:12 EDT 2021 | dwl

I'm concerned by the solder spheres in the via on the first picture. Are these boards mis prints that got washed and printed again? To me it almost looks like someone washed the board, but left a lot of solder paste on it. The lack of flux prevents

Entry level selective soldering

Electronics Forum | Sun Jul 04 13:27:31 EDT 2021 | dilogic

We are looking for new entry-level selective soldering machine. I would appreciate if you can share experience with the equipment you have, as there are many machines on the market and it's a though choice. We will use it for lead-free soldering and

142-1711-801 installation issues

Electronics Forum | Thu Jan 13 22:45:50 EST 2022 | tey422

Seem like extra soldering would really helps it. Adding solder beads by using pick & place machine is more of a consistent way to add extra solder where you need it the most. No matter how you modify the stencil, there is still limits how much you ca


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