Electronics Forum: solderers (Page 266 of 2099)

Re: Cooling

Electronics Forum | Sun Jan 24 19:53:54 EST 1999 | Steve Gregory

| It has been known that sufficient cooling after soldering is important in order to get a stronger joint during its solidification stage. And it has been so much emphasised with reflow oven. But, why many models of wave soldering machine do not come

Re: Desoldering of TSOP and TSOJ

Electronics Forum | Sun Jan 10 08:44:32 EST 1999 | Dave F

| | | HI! I am a package engineer in Korea. I have some reasons | | | to desolder excessive solder at the lead of TSOP and TSOJ | | | after removing them from the board. The way with solder wick is too time-consuming and depends on the operator. |

Selective bridging?

Electronics Forum | Mon Jan 04 11:59:41 EST 1999 | Steve Evers

| Give me your opinions and experiences of SelectX, selective debridging system in the Vitronics Soltec wave soldering machines. | Opinion and (food for thought)?: First let me say that I am not familiar with SelectX. In the past, manufacturing e

Problems with wave solder

Electronics Forum | Tue Nov 17 03:04:38 EST 1998 | Charles Stringer

For some as yet unkown reason, we have started to have some boards sag and go under the wave. The boards are surface mount top side and conventional components wave soldered. We have checked the wave hight and both the profiles on the wave solder and

Re: Azote Soldering

Electronics Forum | Mon Oct 19 09:14:48 EDT 1998 | Greg Flynn

| Greg, | | I may be mistaken but am fairly sure it means Nitrogen or inert gas soldering. | | Soudage sous azote is French for Nitrogen soldering. | | Hope this helps | | Regards, Graham | | Graham.Naisbitt@concoat.co.uk | | Has anybody out the

SOIC solder thieves vs enlarged trailing pads

Electronics Forum | Wed Oct 07 17:36:48 EDT 1998 | Ted Nicholas

Hello! Does any one know of a disadvantage of using the Phillips recommended wave solder SOIC footprint where the last pad on each side of the SOIC is enlarged, instead of placing an extra pair of pads behind the SOIC. Both footprint patterns seem e

Re:

Electronics Forum | Thu Sep 24 20:00:59 EDT 1998 | S. Evers

| I'm looking for information on "volcano" soldering or mini-wave soldering. I need to solder a leaded device, thru-hole, on a already populated smt PCB. I want to do localized soldering on the pins of the device. | Any help would be greatly appreci

Re: Fresh solder generating more dross - C'mon, you guys!

Electronics Forum | Thu Sep 17 10:44:20 EDT 1998 | Chrys

| Hi Folks, | Need to draw upon the vast expertise in this forum... | Whenever you fill a new wave solder machine with fresh bar solder, it seems to produce more than the normal amount of dross for a few weeks. I always understood this to be the sol

Re: Wave Dross Reduction & Klennox

Electronics Forum | Fri Aug 28 13:20:45 EDT 1998 | Justin Medernach

| What approach do you you use to reducing wave solder dross? What is your experience with Klennox? | Dave F Dave, I use Kleenox on my Air-Vac Volcanic Soldering pots. The stuff works great. It significantly reduces the amount of dross you remove

Still Need Info

Electronics Forum | Thu Aug 27 11:08:30 EDT 1998 | Richard Scarcelli

| Would like to know the following information on processing micro bga's: | 1) Fine mesh solder paste .vs. tacky flux --- which is best | 2) Stencil thickness for solder screen | 3) Aperature size for standard pitch balls | 4) Which direction is


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